Deep Tech

Hong Kong Startup Bitmo Lab Rethinks the Design of Location Trackers

Bitmo Lab is testing an ultra-thin, bendable tracker built to fit inside items traditional trackers can’t

Updated

March 17, 2026 1:02 AM

Bitmo Lab's MeetSticker tracker. PHOTO: BITMO LAB

Location trackers have become everyday accessories for keys, bags and luggage. But as personal items grow slimmer and more design-focused — from minimalist wallets to passport sleeves and specialised gear — tracking them has become less straightforward. Most trackers are built as small, rigid discs that assume the presence of space, loops or compartments. That assumption has created a growing mismatch between modern product design and the technology meant to secure it.

Hong Kong–based startup Bitmo Lab is attempting to address that gap with a device called MeetSticker. Instead of the solid plastic casing typical of most trackers, MeetSticker is engineered to be flexible and ultra-thin, measuring just 0.8 millimetres thick. The bendable design allows it to sit within narrow compartments or along curved surfaces without altering the shape of the object. Rather than attaching to an item externally, it is intended to integrate discreetly inside it.

That structural shift is the core of the product’s proposition. By removing the rigid shell that defines conventional tracking hardware, MeetSticker can be placed in items that previously had no practical way to accommodate a tracker. Bitmo Lab states that the device connects through a proprietary network and a companion application compatible with both iOS and Android, positioning it as a cross-platform solution rather than one tied to a single ecosystem.

The implications extend beyond form factor. Objects without obvious attachment points — such as compact travel accessories or specialised tools — could potentially be monitored without visible add-ons. In doing so, the device broadens the scope of tracking technology into categories where aesthetics, aerodynamics or compact design matter as much as functionality.

Before moving toward retail distribution, however, the company is focusing on validation. Bitmo Lab has launched a five-week global alpha testing programme beginning February 9. Sixty participants will receive a prototype unit and early access to the app. According to the company, the programme is designed to assess durability, usability and real-world performance before a wider commercial release. Participants who provide feedback will receive a retail unit upon launch.

Such testing is particularly relevant for flexible electronics. Unlike rigid devices, bendable hardware must withstand repeated flexing, daily handling and environmental exposure. Early user data can help refine manufacturing processes and software optimisation before scaling production.

As with other connected tracking devices, privacy considerations remain part of the equation. Bitmo Lab has stated that data collected during the alpha programme will be used strictly for testing purposes and deleted once the programme concludes.

Whether flexible trackers will redefine the category will depend on how they perform outside controlled testing environments. Still, the introduction of a near-invisible, bendable tracking device reflects a broader shift in consumer technology. As everyday products become thinner and more design-conscious, the tools built to protect them may need to adapt just as seamlessly.

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Operations & Scale

TECO Acquires Malaysian Engineering Firm to Expand Modular AI Data Center Business

The US$50.8 million deal strengthens TECO’s push into modular infrastructure and faster data center deployment across Southeast Asia.

Updated

May 26, 2026 5:39 PM

Kuala Lumpur, Malaysia. PHOTO: UNSPLASH

TECO Electric & Machinery is expanding further into Southeast Asia’s AI data center infrastructure market through a new acquisition in Malaysia.

The Taiwan-based company has signed an agreement to acquire approximately 78 percent of Malaysian engineering firm Dynaciate Engineering in a deal valued at around MYR 200 million (US$50.8 million). According to TECO, the acquisition is aimed at strengthening its modular data center manufacturing capabilities and supporting its expansion across Southeast Asia’s data center infrastructure sector.

Under the agreement, Dynaciate will become TECO’s global manufacturing hub for modular data center and power equipment products. The company will also serve as an engineering hub supporting TECO’s regional expansion efforts, particularly in AI data center infrastructure projects.

TECO Chairman Morris Li said the integration between both companies has improved execution efficiency and increased the company’s in-house modular prefabrication capabilities. According to the company, the collaboration has reduced data center delivery timelines to as little as six months.

Dynaciate is headquartered in Johor Bahru, Malaysia. Its facilities span approximately 36,000 square meters and include eight production buildings focused on stainless steel and carbon steel fabrication. The company said the site is also eligible for export tax incentives that support future global supply chain deployment.

According to TECO, Dynaciate has experience in engineering, steel fabrication and large-scale industrial projects for multinational corporations. The company added that Dynaciate has expanded into the data center engineering market since 2025 through projects involving international cloud service provider clients.

TECO estimates that after the acquisition, around 65 percent of future data center-related revenue will come from modular data centers and prefabricated products, while the remaining 35 percent will come from AI data center engineering projects. The company also forecasts that data center-related revenue within its Power & Energy Business Group will rise from below 10 percent to 30 percent this year.

Dynaciate CEO Ng Kim Thiea said the company is entering a new phase of growth through the partnership with TECO. He added that Dynaciate has extensive experience supporting engineering and industrial projects across the region.

The acquisition marks a further expansion of TECO’s presence in the AI data center infrastructure sector as companies continue increasing investments in modular infrastructure and regional engineering capacity.