A look at how motivation, not metrics, is becoming the real frontier in fitness tech
Updated
February 7, 2026 2:18 PM
A group of people running together. PHOTO: FREEPIK
Most running apps focus on measurement. Distance, pace, heart rate, badges. They record activity well, but struggle to help users maintain consistency over time. As a result, many people track diligently at first, then gradually disengage.
That drop-off has pushed developers to rethink what fitness technology is actually for. Instead of just documenting activity, some platforms are now trying to influence behaviour itself. Paceful, an AI-powered running platform developed by SportsTech startup xCREW, is part of that shift — not by adding more metrics, but by focusing on how people stay consistent. The platform is built on a simple behavioural insight: most people don’t stop exercising because they don’t care about health. They stop because routines are fragile. Miss a few days and the habit collapses. Technology that focuses only on performance metrics doesn’t solve that. Systems that reinforce consistency, belonging and feedback loops might.
Instead of treating running as a solo, data-driven task, Paceful is built around two ideas: behavioural incentives and social alignment. The system turns real-world running activity into tangible rewards and it uses AI to connect runners to people, clubs and challenges that fit how and where they actually run.
At the technical level, Paceful connects with existing fitness ecosystems. Users can import workout data from platforms like Apple Health and Strava rather than starting from scratch. Once inside the system, AI models analyse pace, frequency, location and participation patterns. That data is used to recommend running partners, clubs and group challenges that match each runner’s habits and context.
What makes this approach different is not the tracking itself, but what the platform does with the data it collects. Running distance and consistency become inputs for a reward system that offers physical-world incentives, such as gear, race entries or gift cards. The idea is to link effort to something concrete, rather than abstract. The company also built the system around community logic rather than individual competition. Even solo runners are placed into challenge formats designed to simulate the motivation of a group. In practice, that means users feel part of a shared structure even when running alone.
During a six-month beta phase in the US, xCREW tested Paceful with more than 4,000 running clubs and around 50,000 runners. According to the company, users increased their running frequency significantly and weekly retention remained unusually high for a fitness platform. One beta tester summed it up this way: “Strava just logs records, but Paceful rewards you for every run, which is a completely different motivation”.
The company has raised seed funding and plans to expand the platform beyond running, walking, trekking, cycling and swimming. Instead of asking how accurately technology can measure the body, platforms like Paceful are asking a different question: how technology might influence everyday behaviour. Not by adding more data, but by shaping the conditions around effort, feedback and social connection.
As AI becomes more common in consumer products, its real impact may depend less on how advanced the models are and more on what they are applied to. In this case, the focus isn’t speed or performance — it’s consistency. And whether systems like this can meaningfully support it over time.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.