The collaboration between Oversonic Robotics and STMicroelectronics highlights how robotics is beginning to fill gaps traditional automation cannot.
Updated
January 23, 2026 10:41 AM
3D render of humanoid robots working in a factory assembly line. PHOTO: ADOBE STOCK
Oversonic Robotics, an Italian company known for building cognitive humanoid robots, has signed an agreement with STMicroelectronics, one of the world’s largest semiconductor manufacturers, to deploy humanoid robots inside semiconductor plants.
According to the companies, this is the first time cognitive humanoid robots will be used operationally inside semiconductor manufacturing facilities. And the first deployment has already taken place at ST’s advanced packaging and test plant in Malta.
At the center of the collaboration is RoBee, Oversonic’s humanoid robot. RoBee is designed to carry out support tasks within industrial environments, particularly where flexibility and interaction with human workers are required. In ST’s factories, the robots will assist with complex manufacturing and logistics flows linked to new semiconductor products. They are intended to work alongside existing automation systems, not replace them.
RoBee is notable for its ability to operate in environments shared with people. It is currently the only humanoid robot certified for use in both industrial and healthcare settings and is already in operation within several Italian companies. The robot is also being used in experimental hospital programs. That background helped position RoBee for deployment in tightly controlled manufacturing environments such as semiconductor plants.
Fabio Puglia, President of Oversonic Robotics, described the agreement as a milestone for deploying humanoid robots in complex industrial settings: “The partnership with STMicroelectronics is a great source of pride for us because it embodies the vision of cognitive robotics that Oversonic has brought to the industrial and healthcare markets. Being the first to introduce cognitive humanoid robots in a sophisticated production context such as semiconductors means measuring ourselves against the highest standards in terms of reliability, safety and operational continuity. This agreement represents a fundamental milestone for Oversonic and, more generally, for the industrial challenges these new machines are called to face in innovative and highly complex environments, alongside people and supporting their quality of work”.
From STMicroelectronics’ side, the use of humanoid robots is framed as part of a broader effort to manage growing manufacturing complexity. he company said RoBee will support complex tasks and help manage the intricate production flows required by newer semiconductor products. It is also expected to contribute to improved product quality and shorter manufacturing cycle times. The robots are designed to integrate with existing automation and software systems, helping improve safety and operational continuity.
In semiconductor manufacturing, precision and reliability leave little room for experimentation. Therefore, introducing humanoid robots into this environment signals a practical shift. It shows how robotics is starting to fill gaps that traditional automation has struggled to address.
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The US$50.8 million deal strengthens TECO’s push into modular infrastructure and faster data center deployment across Southeast Asia.
Updated
May 26, 2026 5:39 PM
Kuala Lumpur, Malaysia. PHOTO: UNSPLASH
TECO Electric & Machinery is expanding further into Southeast Asia’s AI data center infrastructure market through a new acquisition in Malaysia.
The Taiwan-based company has signed an agreement to acquire approximately 78 percent of Malaysian engineering firm Dynaciate Engineering in a deal valued at around MYR 200 million (US$50.8 million). According to TECO, the acquisition is aimed at strengthening its modular data center manufacturing capabilities and supporting its expansion across Southeast Asia’s data center infrastructure sector.
Under the agreement, Dynaciate will become TECO’s global manufacturing hub for modular data center and power equipment products. The company will also serve as an engineering hub supporting TECO’s regional expansion efforts, particularly in AI data center infrastructure projects.
TECO Chairman Morris Li said the integration between both companies has improved execution efficiency and increased the company’s in-house modular prefabrication capabilities. According to the company, the collaboration has reduced data center delivery timelines to as little as six months.
Dynaciate is headquartered in Johor Bahru, Malaysia. Its facilities span approximately 36,000 square meters and include eight production buildings focused on stainless steel and carbon steel fabrication. The company said the site is also eligible for export tax incentives that support future global supply chain deployment.
According to TECO, Dynaciate has experience in engineering, steel fabrication and large-scale industrial projects for multinational corporations. The company added that Dynaciate has expanded into the data center engineering market since 2025 through projects involving international cloud service provider clients.
TECO estimates that after the acquisition, around 65 percent of future data center-related revenue will come from modular data centers and prefabricated products, while the remaining 35 percent will come from AI data center engineering projects. The company also forecasts that data center-related revenue within its Power & Energy Business Group will rise from below 10 percent to 30 percent this year.
Dynaciate CEO Ng Kim Thiea said the company is entering a new phase of growth through the partnership with TECO. He added that Dynaciate has extensive experience supporting engineering and industrial projects across the region.
The acquisition marks a further expansion of TECO’s presence in the AI data center infrastructure sector as companies continue increasing investments in modular infrastructure and regional engineering capacity.