Rethinking 3D modelling for a world that generates too much, too quickly.
Updated
January 8, 2026 6:32 PM
A hologram in the franchise Star Wars, in Walt Disney World Resort, Orlando. PHOTO: UNSPLASH
MicroCloud Hologram Inc. (NASDAQ: HOLO), a technology service provider recognized for its holography and imaging systems, is now expanding into a more advanced realm: a quantum-driven 3D intelligent model. The goal is to generate detailed 3D models and images with far less manual effort — a need that has only grown as industries flood the world with more visual data every year.
The concept is straightforward, even if the technology behind it isn’t. Traditional 3D modeling workflows are slow, fragmented and depend on large teams to clean datasets, train models, adjust parameters and fine-tune every output. HOLO is trying to close that gap by combining quantum computing with AI-powered 3D modeling, enabling the system to process massive datasets quickly and automatically produce high-precision 3D assets with much less human involvement.
To achieve this, the company developed a distributed architecture comprising of several specialized subsystems. One subsystem collects and cleans raw visual data from different sources. Another uses quantum deep learning to understand patterns in that data. A third converts the trained model into ready-to-use 3D assets based on user inputs. Additional modules manage visualization, secure data storage and system-wide protection — all supported by quantum-level encryption. Each subsystem runs in its own container and communicates through encrypted interfaces, allowing flexible upgrades and scaling without disrupting the entire system.
Why this matters: Industries ranging from gaming and film to manufacturing, simulation and digital twins are rapidly increasing their reliance on 3D content. The real bottleneck isn’t creativity — it’s time. Producing accurate, high-quality 3D assets still requires a huge amount of manual processing. HOLO’s approach attempts to lighten that workload by utilizing quantum tools to speed up data processing, model training, generation and scaling, while keeping user data secure.
According to the company, the system’s biggest advantages include its ability to handle massive datasets more efficiently, generate precise 3D models with fewer manual steps, and scale easily thanks to its modular, quantum-optimized design. Whether quantum computing will become a mainstream part of 3D production remains an open question. Still, the model shows how companies are beginning to rethink traditional 3D workflows as demand for high-quality digital content continues to surge.
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The US$50.8 million deal strengthens TECO’s push into modular infrastructure and faster data center deployment across Southeast Asia.
Updated
May 26, 2026 5:39 PM
Kuala Lumpur, Malaysia. PHOTO: UNSPLASH
TECO Electric & Machinery is expanding further into Southeast Asia’s AI data center infrastructure market through a new acquisition in Malaysia.
The Taiwan-based company has signed an agreement to acquire approximately 78 percent of Malaysian engineering firm Dynaciate Engineering in a deal valued at around MYR 200 million (US$50.8 million). According to TECO, the acquisition is aimed at strengthening its modular data center manufacturing capabilities and supporting its expansion across Southeast Asia’s data center infrastructure sector.
Under the agreement, Dynaciate will become TECO’s global manufacturing hub for modular data center and power equipment products. The company will also serve as an engineering hub supporting TECO’s regional expansion efforts, particularly in AI data center infrastructure projects.
TECO Chairman Morris Li said the integration between both companies has improved execution efficiency and increased the company’s in-house modular prefabrication capabilities. According to the company, the collaboration has reduced data center delivery timelines to as little as six months.
Dynaciate is headquartered in Johor Bahru, Malaysia. Its facilities span approximately 36,000 square meters and include eight production buildings focused on stainless steel and carbon steel fabrication. The company said the site is also eligible for export tax incentives that support future global supply chain deployment.
According to TECO, Dynaciate has experience in engineering, steel fabrication and large-scale industrial projects for multinational corporations. The company added that Dynaciate has expanded into the data center engineering market since 2025 through projects involving international cloud service provider clients.
TECO estimates that after the acquisition, around 65 percent of future data center-related revenue will come from modular data centers and prefabricated products, while the remaining 35 percent will come from AI data center engineering projects. The company also forecasts that data center-related revenue within its Power & Energy Business Group will rise from below 10 percent to 30 percent this year.
Dynaciate CEO Ng Kim Thiea said the company is entering a new phase of growth through the partnership with TECO. He added that Dynaciate has extensive experience supporting engineering and industrial projects across the region.
The acquisition marks a further expansion of TECO’s presence in the AI data center infrastructure sector as companies continue increasing investments in modular infrastructure and regional engineering capacity.