Sensing technology is facilitating the transition of drone delivery services from trial phases to regular daily operations.
Updated
January 23, 2026 10:41 AM
A quadcopter drone with package attached. PHOTO: FREEPIK
A new partnership between Hesai Technology, a LiDAR solutions company and Keeta Drone, an urban delivery platform under Meituan, offers a glimpse into how drone delivery is moving from experimentation to real-world scale.
Under the collaboration, Hesai will supply solid-state LiDAR sensors for Keeta’s next-generation delivery drones. The goal is to make everyday drone deliveries more reliable as they move from trials to routine operations. Keeta Drone operates in a challenging space—low-altitude urban airspace. Its drones deliver food, medicine and emergency supplies across cities such as Beijing, Shanghai, Hong Kong and Dubai. With more than 740,000 deliveries completed across 65 routes, the company has discontinued testing the concept. It is scaling it. For that scale to work, drones must be able to navigate crowded environments filled with buildings, trees, power lines and unpredictable conditions. This is where Hesai’s technology comes in.
Hesai’s solid-state LiDAR is integrated into Keeta's latest long-range delivery drones. LiDAR stands for Light Detection and Ranging. In simple terms, it is a sensing technology that helps machines understand their surroundings by sending out laser pulses and measuring how they bounce back. Unlike GPS, LiDAR does not rely solely on satellites to determine position. Instead, it gives drones a direct sense of their surroundings, helping them spot small but critical obstacles like wires or tree branches.
In a recent demonstration, Keeta Drone completed a nighttime flight using LiDAR-based navigation alone without relying on cameras or satellite positioning. This shows how the technology can support stable operations even when visibility is poor or GPS signals are limited.
The LiDAR system used in these drones is Hesai’s second-generation solid-state model known as FTX. Compared with earlier versions, the sensor offers higher resolution while being smaller and lighter—important considerations for airborne systems where weight and space are limited. The updated design also reduces integration complexity, making it easier to incorporate into commercial drone platforms. Large-scale production of the sensor is expected to begin in 2026.
From Hesai’s perspective, delivery drones are one of several forms robots are expected to take in the coming decades. Industry forecasts suggest robots will increasingly appear in many roles from industrial systems to service applications, with drones becoming a familiar part of urban infrastructure rather than a novelty.
For Keeta Drone, this improves safety and reliability. And for the broader industry, it signals that drone logistics is entering a more mature phase—one defined less by experimentation and more by dependable execution. Taken together, the partnership highlights a practical evolution in drone delivery.
As cities grow more complex, the question is no longer whether drones can fly but whether they can do so reliably, safely and at scale. At its core, this partnership is not about drones or sensors as products. It is about what it takes to make a complex system work quietly in real cities. As drone delivery moves out of pilot zones and into everyday use, reliability matters more than novelty.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.