Turning computing heat into a practical heating solution for greenhouses.
Updated
January 23, 2026 10:41 AM
Inside of a workstation computer with red lighting. PHOTO: UNSPLASH
Most computing systems have one unavoidable side effect: they get hot. That heat is usually treated as a problem and pushed away using cooling systems. Canaan Inc., a technology company that builds high-performance computing machines, is now showing how that same heat can be reused instead of wasted.
In a pilot project in Manitoba, Canada, Canaan is working with greenhouse operator Bitforest Investment to recover heat generated by its computing systems. Rather than focusing only on computing output, the project looks at a more basic question—what happens to all the heat these machines produce and can it serve a practical purpose?
The idea is simple. Canaan’s computers run continuously and naturally generate heat. Instead of releasing that heat into the environment, the system captures it and uses it to warm water. That warm water is then fed into the greenhouse’s existing heating system. As a result, the greenhouse needs less additional energy to maintain the temperatures required for plant growth.
This is enabled through liquid cooling. Instead of using air to cool the machines, a liquid circulates through the system and absorbs heat more efficiently. Because liquid retains heat better than air, the recovered water reaches temperatures that are suitable for industrial use. In effect, the computing system supports greenhouse heating while continuing to perform its primary computing function.
What makes this approach workable is that it integrates with existing infrastructure. The recovered heat does not replace the greenhouse’s boilers but supplements them. By preheating the water that enters the boiler system, the overall energy demand is reduced. Based on current assumptions, Canaan estimates that a significant portion of the electricity used by the servers can be recovered as usable heat, though actual results will be confirmed once the system is fully operational.
This matters because heating is one of the largest energy expenses for commercial greenhouses, particularly in colder regions like Canada. Many facilities still rely heavily on fossil-fuel-based heating and policies such as carbon pricing are encouraging lower-emission alternatives. Reusing computing heat offers a way to improve efficiency without requiring a complete overhaul of existing systems.
The project is planned to run for an initial two-year period, allowing Canaan to evaluate real-world performance factors such as reliability, system stability and maintenance needs. These findings will help determine whether the model can be replicated in other agricultural or industrial settings.
More broadly, the initiative reflects a shift in how computing infrastructure can be designed. Instead of operating as energy-intensive systems isolated from everyday use, computing equipment can contribute to real-world applications. Canaan’s greenhouse pilot highlights how excess heat—often seen as a by-product—can become part of a more efficient and thoughtful energy loop.
In doing so, the project suggests that improving sustainability in technology is not only about reducing energy consumption, but also about finding smarter ways to reuse the energy already being generated.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.