A breakdown of the mission aiming to turn space into the next layer of digital infrastructure.
Updated
January 8, 2026 6:32 PM
The Hubble Space Telescope, one of the fist space infrastructures. PHOTO: UNSPLASH
PowerBank Corporation and Smartlink AI, the company behind Orbit AI, are preparing to send a very different kind of satellite into space. Their upcoming mission, scheduled for December 2025, aims to test what they call the world’s first “Orbital Cloud” — a system that moves parts of today’s digital infrastructure off the ground and into orbit. While satellites already handle GPS, TV signals and weather data, this project tries to do something bigger: turn space itself into a platform for computing, artificial intelligence (AI) and secure blockchain-based digital transactions. In essence, it marks the beginning of space-based cloud computing.
To understand why this matters, it is helpful to examine the limitations of our current systems. As AI tools grow more advanced, they require massive data centers that consume enormous amounts of electricity, especially for cooling. These facilities depend on national power grids, face regulatory constraints and are concentrated in just a few regions. Meanwhile, global connectivity still struggles with inequalities, censorship, congestion and geopolitical bottlenecks. The Orbital Cloud is meant to plug these gaps by building a computing and communication layer above Earth — a solar-powered, space-cooled network in Low Earth Orbit (LEO) that no single nation or company fully controls.
Orbit AI’s approach brings together two new systems. The first, called DeStarlink, is a decentralized satellite network designed for global internet-style connectivity and resilient communication. The second, DeStarAI, is a set of AI-focused in-orbit data centers placed directly on satellites, using space’s naturally cold environment instead of the energy-hungry cooling towers used on Earth. When these two ideas merge, the result is a floating digital layer where information can be transmitted, processed and verified without touching terrestrial infrastructure — a key shift in how AI workloads and cloud computing may be handled in the future.
PowerBank enters the picture by supplying the electricity and temperature-control technology needed to keep these satellites running. In space, sunlight is constant and uninterrupted — no clouds, no storms, no nighttime periods where panels lie idle. PowerBank plans to provide high-efficiency solar arrays and adaptive thermal systems that help the satellites manage heat in orbit. This collaboration marks a shift for PowerBank, which is expanding from traditional solar and battery projects into the realm of digital infrastructure, AI energy systems and next-generation satellite technology.
Describing the ambition behind this move, Dr. Richard Lu, CEO of PowerBank, said: “The next frontier of human innovation isn't just in space exploration, it's in building the infrastructure of tomorrow above the Earth”. He pointed to a future market that could surpass US$700 billion, driven by orbital satellites, AI computing in space, blockchain verification and solar-powered data systems. Integrating solar energy with orbital computing, he said, could help create “a globally sovereign, AI-enabled digital layer in space, which is a system that can help power finance, communications and critical infrastructure”.
Orbit AI’s Co-Founder and CEO, Gus Liu, describes their satellites as deliberately autonomous and intelligent. “Orbit AI is creating the first truly intelligent layer in orbit — satellites that compute, verify and optimize themselves autonomously”, he said, “The Orbital Cloud turns space into a platform for AI, blockchain and global connectivity. By leveraging solar-powered compute payloads and decentralized verification nodes, we are opening an entirely new, potentially US$700+ billion-dollar market opportunity — one that combines energy, data and sovereignty to reshape industries from finance to government and Web3. PowerBank's expertise in advanced solar energy systems will be significant in supporting this initiative."
This vision is not isolated. Earlier this year, Jeff Bezos echoed a similar idea at Italian Tech Week, saying: “We will be able to beat the cost of terrestrial data centres in space in the next couple of decades. These giant training clusters will be better built in space, because we have solar power there, 24/7 — no clouds, no rain, no weather. The next step is going to be data centres and then other kinds of manufacturing.” His comments reflect a growing industry belief that space-based data centers will eventually outperform those on Earth.
The idea gains traction because the advantages are practical. Space offers free, constant solar power. It provides natural cooling, which is one of the costliest parts of running data centers on Earth. And above all, satellites in low-Earth orbit operate beyond national firewalls and political boundaries, making them more resilient to outages, censorship and conflict. For industries that rely heavily on secure connectivity and real-time data — finance, defense, AI, blockchain networks and global cloud providers — this could become an important alternative layer of infrastructure.
The upcoming Genesis-1 satellite is designed as a demonstration mission. It will test an Ethereum wallet, run a blockchain verification node and perform simple AI tasks in orbit. If the technology works as expected, Orbit AI plans to add several more satellites in 2026, expand into larger networks by 2027 and 2028 and begin full commercial operations by the decade’s end.
To build this system, Orbit AI plans to source technologies from some of the world’s most influential players: NVIDIA for AI processors, the Ethereum Foundation for blockchain tools, Galaxy Space and SparkX Satellite for satellite components, Galactic Energy for launch systems and AscendX Aerospace for advanced materials.
If successful, the Orbital Cloud could become the first step toward a world where part of humanity’s data, computing power and digital services run not in massive buildings on Earth, but in clusters of autonomous satellites illuminated by constant sunlight. For now, the journey begins with a single launch — a test satellite aiming to show that space can do far more than connect us. It may soon help power the systems that run our economies, technologies and global communication networks.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.