Operations & Scale

TECO Acquires Malaysian Engineering Firm to Expand Modular AI Data Center Business

The US$50.8 million deal strengthens TECO’s push into modular infrastructure and faster data center deployment across Southeast Asia.

Updated

May 26, 2026 5:39 PM

Kuala Lumpur, Malaysia. PHOTO: UNSPLASH

TECO Electric & Machinery is expanding further into Southeast Asia’s AI data center infrastructure market through a new acquisition in Malaysia.

The Taiwan-based company has signed an agreement to acquire approximately 78 percent of Malaysian engineering firm Dynaciate Engineering in a deal valued at around MYR 200 million (US$50.8 million). According to TECO, the acquisition is aimed at strengthening its modular data center manufacturing capabilities and supporting its expansion across Southeast Asia’s data center infrastructure sector.

Under the agreement, Dynaciate will become TECO’s global manufacturing hub for modular data center and power equipment products. The company will also serve as an engineering hub supporting TECO’s regional expansion efforts, particularly in AI data center infrastructure projects.

TECO Chairman Morris Li said the integration between both companies has improved execution efficiency and increased the company’s in-house modular prefabrication capabilities. According to the company, the collaboration has reduced data center delivery timelines to as little as six months.

Dynaciate is headquartered in Johor Bahru, Malaysia. Its facilities span approximately 36,000 square meters and include eight production buildings focused on stainless steel and carbon steel fabrication. The company said the site is also eligible for export tax incentives that support future global supply chain deployment.

According to TECO, Dynaciate has experience in engineering, steel fabrication and large-scale industrial projects for multinational corporations. The company added that Dynaciate has expanded into the data center engineering market since 2025 through projects involving international cloud service provider clients.

TECO estimates that after the acquisition, around 65 percent of future data center-related revenue will come from modular data centers and prefabricated products, while the remaining 35 percent will come from AI data center engineering projects. The company also forecasts that data center-related revenue within its Power & Energy Business Group will rise from below 10 percent to 30 percent this year.

Dynaciate CEO Ng Kim Thiea said the company is entering a new phase of growth through the partnership with TECO. He added that Dynaciate has extensive experience supporting engineering and industrial projects across the region.

The acquisition marks a further expansion of TECO’s presence in the AI data center infrastructure sector as companies continue increasing investments in modular infrastructure and regional engineering capacity.

Keep Reading

Funding & Deals

Myrias Optics Raises US$2.1 Million Seed 1 Round to Scale Nano-Patterned Light-Control Technology

A Massachusetts startup advances scalable light-control tech for AR, AI and imaging markets

Updated

March 17, 2026 1:01 AM

Myrias Optics' Nanoimprinted All-inorganic Metaoptic. PHOTO: MYRIAS OPTICS

Myrias Optics, a Massachusetts-based optical technology startup, has raised US$2.1 million in a Seed 1 financing round to accelerate the commercialization of its advanced light-control technology. The round was led by MassVentures, with participation from existing investors Hoss Investment Inc., Maroon Venture Partners and Tenon Venture Partners, as well as new investors Mill Town Capital, TiE Boston Angels and Doug Crane. This new round follows a US$3.3 million seed financing completed in December 2023, led by Asia Optical, and a US$1.5 million Direct-to-Phase II award from the National Science Foundation. In total, Myrias has secured US$6.9 million to date, positioning it to move from development to scaled production.

The company builds ultra-thin, nano-patterned surfaces that precisely control how light moves through a device. These structures replace or enhance traditional lenses and optical parts inside products such as augmented reality headsets, AI data center hardware, consumer electronics, industrial systems and medical imaging devices. The goal is straightforward: to deliver high optical performance while making the parts easier and more cost-effective to manufacture in large quantities.

Across industries such as augmented reality and AI infrastructure, manufacturers face a common challenge. They need highly precise light-guiding components that can withstand heat and long-term use. At the same time, those components must be produced consistently and at scale. Traditional semiconductor-style fabrication can be costly, while polymer-based optical manufacturing can face limits in durability and thermal stability.

Myrias addresses this gap by using inorganic materials and a nanoimprint manufacturing process to create stable, repeatable optical layers on wafers. This approach is designed to combine performance with manufacturability. In augmented reality systems, for example, the company’s technology enables higher viewing angles while remaining suitable for volume production. In AI data centers, the same material and process advantages support improved light transfer and stronger performance under demanding thermal conditions. These benefits also extend to advanced imaging systems in consumer, industrial and medical markets.

The new Seed 1 funding is intended to expand manufacturing capacity and scale pilot production lines. The company will also continue executing active customer programs. Myrias is already working with strategic partners and Tier 1 supply chain participants to integrate its waveguide and light-shaping solutions into commercial AR platforms, AI photonics systems and advanced imaging products. The capital, therefore, supports a clear next step: moving from validated prototypes to a steady commercial supply.