Why investors are backing Applied Brain Research’s on-device voice AI approach.
Updated
January 28, 2026 5:53 PM
Plastic model of a human's brain. PHOTO: UNSPLASH
Applied Brain Research (ABR), a Canada-based startup, has closed its seed funding round to advance its work in “on-device voice AI”. The round was led by Two Small Fish Ventures, with its general partner Eva Lau joining ABR’s board, reflecting investor confidence in the company’s technical direction and market focus.
The round was oversubscribed, meaning more investors wanted to participate than the company had planned for. That response reflects growing interest in technologies that reduce reliance on cloud-based AI systems.
ABR is focused on a clear problem in voice-enabled products today. Most voice features depend on cloud servers to process speech, which can cause delays, increase costs, raise privacy concerns and limit performance on devices with small batteries or limited computing power.
ABR’s approach is built around keeping voice AI fully on-device. Instead of relying on cloud connectivity, its technology allows devices to process speech locally, enabling faster responses and more predictable performance while reducing data exposure.
Central to this approach is the company’s TSP1 chip, a processor designed specifically for handling time-based data such as speech. Built for real-time voice processing at the edge, TSP1 allows tasks like speech recognition and text-to-speech to run on smaller, power-constrained devices.
This specialization is particularly relevant as voice interfaces become more common across emerging products. Many edge devices such as wearables or mobile robotics cannot support traditional voice AI systems without compromising battery life or responsiveness. The TSP1 addresses this limitation by enabling these capabilities at significantly lower power levels than conventional alternatives. According to the company, full speech-to-text and text-to-speech can run at under 30 milliwatts of power, which is roughly 10 to 100 times lower than many existing alternatives. This level of efficiency makes advanced voice interaction feasible on devices where power consumption has long been a limiting factor.
That efficiency makes the technology applicable across a wide range of use cases. In augmented reality glasses, it supports responsive, hands-free voice control. In robotics, it enables real-time voice interaction without cloud latency or ongoing service costs. For wearables, it expands voice functionality without severely impacting battery life. In medical devices, it allows on-device inference while keeping sensitive data local. And in automotive systems, it enables consistent voice experiences regardless of network availability.
For investors, this combination of timing and technology is what stands out. Voice interfaces are becoming more common, while reliance on cloud infrastructure is increasingly seen as a limitation rather than a strength. ABR sits at the intersection of those two shifts.
With fresh funding in place, ABR is now working with partners across AR, robotics, healthcare, automotive and wearables to bring that future closer. For startup watchers, it’s a reminder that some of the most meaningful AI advances aren’t about bigger models but about making intelligence fit where it actually needs to live.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.