How Korea is trying to take control of its AI future.
Updated
January 13, 2026 10:56 AM
SK Telecom Headquarters in Seoul, South Korea. PHOTO: ADOBE STOCK
SK Telecom, South Korea’s largest mobile operator, has unveiled A.X K1, a hyperscale artificial intelligence model with 519 billion parameters. The model sits at the center of a government-backed effort to build advanced AI systems and domestic AI infrastructure within Korea. This comes at a time when companies in the United States and China largely dominate the development of the most powerful large language models.
Rather than framing A.X K1 as just another large language model, SK Telecom is positioning it as part of a broader push to build sovereign AI capacity from the ground up. The model is being developed as part of the Korean government’s Sovereign AI Foundation Model project, which aims to ensure that core AI systems are built, trained and operated within the country. In simple terms, the initiative focuses on reducing reliance on foreign AI platforms and cloud-based AI infrastructure, while giving Korea more control over how artificial intelligence is developed and deployed at scale.
One of the gaps this approach is trying to address is how AI knowledge flows across a national ecosystem. Today, the most powerful AI foundation models are often closed, expensive and concentrated within a small number of global technology companies. A.X K1 is designed to function as a “teacher model,” meaning it can transfer its capabilities to smaller, more specialized AI systems. This allows developers, enterprises and public institutions to build tailored AI tools without starting from scratch or depending entirely on overseas AI providers.
That distinction matters because most real-world applications of artificial intelligence do not require massive models operating independently. They require focused, reliable AI systems designed for specific use cases such as customer service, enterprise search, manufacturing automation or mobility. By anchoring those systems to a large, domestically developed foundation model, SK Telecom and its partners are aiming to create a more resilient and self-sustaining AI ecosystem.
The effort also reflects a shift in how AI is being positioned for everyday use. SK Telecom plans to connect A.X K1 to services that already reach millions of users, including its AI assistant platform A., which operates across phone calls, messaging, web services and mobile applications. The broader goal is to make advanced AI feel less like a distant research asset and more like an embedded digital infrastructure that supports daily interactions.
This approach extends beyond consumer-facing services. Members of the SKT consortium are testing how the hyperscale AI model can support industrial and enterprise applications, including manufacturing systems, game development, robotics and autonomous technologies. The underlying logic is that national competitiveness in artificial intelligence now depends not only on model performance, but on whether those models can be deployed, adapted and validated in real-world environments.
There is also a hardware dimension to the project. Operating an AI model at the 500-billion-parameter scale places heavy demands on computing infrastructure, particularly memory performance and communication between processors. A.X K1 is being used to test and validate Korea’s semiconductor and AI chip capabilities under real workloads, linking large-scale AI software development directly to domestic semiconductor innovation.
The initiative brings together technology companies, universities and research institutions, including Krafton, KAIST and Seoul National University. Each contributes specialized expertise ranging from data validation and multimodal AI research to system scalability. More than 20 institutions have already expressed interest in testing and deploying the model, reinforcing the idea that A.X K1 is being treated as shared national AI infrastructure rather than a closed commercial product.
Looking ahead, SK Telecom plans to release A.X K1 as open-source AI software, alongside APIs and portions of the training data. If fully implemented, the move could lower barriers for developers, startups and researchers across Korea’s AI ecosystem, enabling them to build on top of a large-scale foundation model without incurring the cost and complexity of developing one independently.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.