From pre-orders to market entry, Rokid’s Taiwan campaign reflects how AI hardware is being introduced to consumers today.
Updated
January 8, 2026 6:30 PM
Rokid Glasses, a pair of AR glasses from Rokid. PHOTO: ROKID
Rokid has reached a significant crowdfunding milestone in Taiwan. Its Rokid Glasses campaign surpassed NT$62 million in pre-order funding on zeczec, Taiwan’s creative-oriented crowdfunding platform. The campaign ranked No. 1 across all categories on the platform in 2025 and entered the Top 10 funded campaigns in zeczec’s history, setting new records for AI and XR-related projects.
The campaign launched on October 28 and became one of the platform’s most prominent technology initiatives of the year. According to the company, the outcome followed growing visibility for Rokid Glasses after product showcases in New York, Berlin, Singapore and Paris, positioning the Taiwan campaign within a broader international rollout.
The crowdfunding achievement coincided with Rokid’s official market entry in Taiwan. On December 10, the company debuted Rokid Glasses locally, introducing the product to media, partners and early users in the region. The Taiwan launch mirrored earlier international events and connected the online crowdfunding campaign with a physical market presence.
Rokid Glasses combine augmented reality displays with built-in AI functions, including real-time multilingual translation, live transcription, navigation, object recognition and voice assistance. These capabilities were central to how the product was presented during both the crowdfunding campaign and the Taiwan launch, without framing the project as a traditional consumer electronics release.
The Taiwan campaign builds on Rokid’s prior crowdfunding history. The company previously raised more than US$4 million on Kickstarter, where Rokid Glasses became the highest-funded XR wearable project on the platform. The zeczec campaign extends that track record into one of Asia’s most established consumer electronics markets.
“Taiwan has one of the world's most mature and discerning consumer electronics markets”, said Said Justo Chang, Head of Global Channels at Rokid. “Reaching the top of Taiwan's crowdfunding platform is a great commercial achievement. We are excited to finally introduce Rokid Glasses to Taiwan”.
More broadly, the campaign highlights how crowdfunding platforms continue to function as launch and distribution channels for emerging AI and XR hardware. In Rokid’s case, product rollout, market entry and public participation converged within a single campaign, marking a notable moment for AI-enabled wearables in Taiwan’s technology landscape.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.