With Phia’s AI, the new luxury is knowing what’s worth buying
Updated
February 10, 2026 12:56 PM
Phoebe Gates and Sophia Kianni, founders of Phia. PHOTO: PHIA
AI has transformed how we shop—predicting trends, powering virtual try-ons and streamlining fashion logistics. Yet some of the biggest pain points remain: endless scrolling, too many tabs and never knowing if you’ve overpaid. That’s the gap Phia aims to close.
Co-founded by Phoebe Gates, daughter of Bill Gates, and climate activist Sophia Kianni, Phia was born in a Stanford dorm room and launched in April 2025. The app, available on mobile and as a browser extension, compares prices across over 40,000 retailers and thrift platforms to show what an item really costs. Its hallmark feature, “Should I Buy This?”, instantly flags whether something is overpriced, fair or a genuine deal.
The mission is simple: make shopping smarter, fairer and more sustainable. In just five months, Phia has attracted more than 500,000 users, indexed billions of products and built over 5,000 brand partnerships. It also secured a US$8 million seed round led by Kleiner Perkins, joined by Hailey Bieber, Kris Jenner, Sara Blakely and Sheryl Sandberg—investors who bridge tech, retail and culture. “Phia is redefining how people make purchase decisions,” said Annie Case, partner at Kleiner Perkins.
Phia’s AI engine scans real-time data from more than 250 million products across its network, including Vestiaire Collective, StockX, eBay and Poshmark. Beyond comparing prices, the app helps users discover cheaper or more sustainable options by displaying pre-owned items next to new ones—helping users see the full spectrum of choices before they buy. It also evaluates how different brands perform over time, analysing how well their products hold resale value. This insight helps shoppers judge whether a purchase is likely to last in value or if opting for a second-hand version makes more sense. The result is a platform that naturally encourages circular shopping—keeping items in use longer through resale, repair or recycling—and resonates strongly with Gen Z and millennial values of sustainability and mindful spending.
By encouraging transparency and smarter choices, Phia signals a broader shift in consumer technology: one where AI doesn’t just automate decisions but empowers users to understand them. Instead of merely digitizing the act of shopping, Phia embodies data-driven accountability—using intelligent search to help consumers make informed and ethical choices in markets long clouded by complexity. Retail analysts believe this level of visibility could push brands to maintain accurate and competitive pricing. Skeptics, however, argue that Phia must evolve beyond comparison to create emotional connection and loyalty. Still, one fact stands out: algorithms are no longer just recommending what we buy—they’re rewriting how we decide.
With new funding powering GPU expansion and advanced personalization tools, Phia’s next step is to build a true AI shopping agent—one that helps people buy better, live smarter and rethink what it means to shop with purpose.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.