New Physical AI Technology: How Atomathic’s AIDAR and AISIR Improve Machine Sensing

Atomathic, the company once known as Neural Propulsion Systems, is stepping into the spotlight with a bold claim: its new AI platforms can help machines “see the invisible”. With the commercial launch of AIDAR™ and AISIR™, the company says it is opening a new chapter for physical AI, AI sensing and advanced sensor technology across automotive, aviation, defense, robotics and semiconductor manufacturing.

The idea behind these platforms is simple yet ambitious. Machines gather enormous amounts of signal data, yet they still struggle to understand the faint, fast or hidden details that matter most when making decisions. Atomathic says its software closes that gap. By applying AI signal processing directly to raw physical signals, the company aims to help sensors pick up subtle patterns that traditional systems miss, enabling faster reactions and more confident autonomous system performance.

"To realize the promise of physical AI, machines must achieve greater autonomy, precision and real-time decision-making—and Atomathic is defining that future," said Dr. Behrooz Rezvani, Founder and CEO of Atomathic. "We make the invisible visible. Our technology fuses the rigor of mathematics with the power of AI to transform how sensors and machines interact with the world—unlocking capabilities once thought to be theoretical. What can be imagined mathematically can now be realized physically."

This technical shift is powered by Atomathic’s deeper mathematical framework. The core of its approach is a method called hyperdefinition technology, which uses the Atomic Norm and fast computational techniques to map sparse physical signals. In simple terms, it pulls clarity out of chaos. This enables ultra-high-resolution signal visualization in real time—something the company claims has never been achieved at this scale in real-time sensing.

AIDAR and AISIR are already being trialled and integrated across multiple sectors and they’re designed to work with a broad range of hardware. That hardware-agnostic design is poised to matter even more as industries shift toward richer, more detailed sensing. Analysts expect the automotive sensor market to surge in the coming years, with radar imaging, next-gen ADAS systems and high-precision machine perception playing increasingly central roles.

Atomathic’s technology comes from a tight-knit team with deep roots in mathematics, machine intelligence and AI research, drawing talent from institutions such as Caltech, UCLA, Stanford and the Technical University of Munich. After seven years of development, the company is ready to show its progress publicly, starting with demonstrations at CES 2026 in Las Vegas.

Suppose the future of autonomy depends on machines perceiving the world with far greater fidelity. In that case, Atomathic is betting that the next leap forward won’t come from more hardware, but from rethinking the math behind the signal—and redefining what physical AI can do.

Keep Reading

Artificial Intelligence

AMD’s US$10 Billion Taiwan Expansion Signals a New Race for AI Infrastructure Scale

AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.

Ventureport Media Team

Updated

May 26, 2026 5:28 PM

Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH

As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.

The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.

The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.

AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.

The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.

At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.

Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.

Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.

Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.

Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.

AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.