How KIOXIA’s Memory-Centric AI Tackles Growing Challenges in Logistics

E-commerce keeps growing and with it, the number of products moving through warehouses every day. Items vary more than ever — different shapes, seasonal packaging, limited editions and constantly updated designs. At the same time, many logistics centers are dealing with labour shortages and rising pressure to automate.

But today’s image-recognition AI isn’t built for this level of change. Most systems rely on deep-learning models that need to be adjusted or retrained whenever new products appear. Every update — whether it’s a new item or a packaging change — adds extra time, energy use and operational cost. And for warehouses handling huge product catalogs, these retraining cycles can slow everything down.

KIOXIA, a company known for its memory and storage technologies, is working on a different approach. In a new collaboration with Tsubakimoto Chain and EAGLYS, the team has developed an AI-based image recognition system that is designed to adapt more easily as product lines grow and shift. The idea is to help logistics sites automatically identify items moving through their workflows without constantly reworking the core AI model.

At the center of the system is KIOXIA’s AiSAQ software paired with its Memory-Centric AI technology. Instead of retraining the model each time new products appear, the system stores new product data — images, labels and feature information — directly in high-capacity storage. This allows warehouses to add new items quickly without altering the original AI model.

Because storing more data can lead to longer search times, the system also indexes the stored product information and transfers the index into SSD storage. This makes it easier for the AI to retrieve relevant features fast, using a Retrieval-Augmented Generation–style method adapted for image recognition.

The collaboration will be showcased at the 2025 International Robot Exhibition in Tokyo. Visitors will see the system classify items in real time as they move along a conveyor, drawing on stored product features to identify them instantly. The demonstration aims to illustrate how logistics sites can handle continuously changing inventories with greater accuracy and reduced friction.

Overall, as logistics networks become increasingly busy and product lines evolve faster than ever, this memory-driven approach provides a practical way to keep automation adaptable and less fragile.

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Artificial Intelligence

AMD’s US$10 Billion Taiwan Expansion Signals a New Race for AI Infrastructure Scale

AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.

Ventureport Media Team

Updated

May 26, 2026 5:28 PM

Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH

As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.

The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.

The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.

AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.

The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.

At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.

Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.

Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.

Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.

Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.

AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.