Inside Mercuryo’s Visa Partnership
Updated
February 10, 2026 11:18 PM
Close up of Visa credit cards. PHOTO: ADOBE STOCK
Mercuryo is a fintech startup that builds the infrastructure to enable money to move seamlessly between crypto and traditional banking systems. In simple terms, it works on the problem of turning digital assets into usable cash.
As more people hold crypto through wallets and exchanges, one practical issue keeps arising: how do you actually withdraw that money and use it in the real world? For many users, converting tokens into local currency is still slow, confusing or expensive. That gap between “owning” crypto and being able to spend it is where Mercuryo operates.
The company’s latest step forward is a partnership with Visa to improve what is known as “off-ramping” — the process of converting crypto into fiat currency like dollars or euros. Until now, this has often been slow, expensive and confusing for users. Mercuryo is using Visa Direct, Visa’s real-time payments system, to make that process faster and more direct.
With this integration, users can convert their digital tokens into local currency and send the money straight to a Visa debit or credit card. The transaction happens through systems that already power global card payments, which means the money can arrive in near real time instead of days later.
Technically, this connects two very different worlds. On one side is blockchain-based crypto, which moves value on decentralised networks. On the other side is the traditional payment system, which runs on banks, cards and regulated rails. Mercuryo’s platform sits between the two and handles the conversion and movement of funds.
Instead of users leaving their wallet or exchange to cash out, Mercuryo allows the conversion to happen inside the apps and platforms they already use. The user does not need to understand the plumbing behind it. They just see that crypto becomes spendable money on their card.
This matters because access is what makes any financial system usable. If people cannot easily move their money, they treat it as locked or risky. Faster off-ramps make digital assets more practical, not just speculative.
Mercuryo’s work is not about creating new tokens or trading tools. It is about building the pipes that let money move smoothly between Web3 and the traditional financial world. The Visa partnership strengthens those pipes by using a global, trusted payments network that already works at scale.
Visa also framed the partnership as a bridge between systems. Anastasia Serikova, Head of Visa Direct, Europe, said: "By leveraging Visa Direct's capabilities, Mercuryo is not only making converting to fiat faster, simpler and more accessible than ever—it's building bridges between the crypto space and the traditional financial system. This integration empowers users to seamlessly convert digital assets into fiat in near real time, creating a more connected and convenient payment experience".
Over time, this kind of infrastructure is what determines whether crypto remains niche or becomes part of everyday finance. Not through headlines, but through systems that quietly reduce friction.
Mercuryo’s direction is clear: make digital assets easier to use, easier to exit and easier to connect to the money systems people already rely on.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.