The upgraded CodeFusion Studio 2.0 simplifies how developers design, test and deploy AI on embedded systems.
Updated
January 8, 2026 6:34 PM
Illustration of CodeFusion Studio™ 2.0 showing AI, code and chip icons. PHOTO: ANALOG DEVICES, INC.
Analog Devices (ADI), a global semiconductor company, launched CodeFusion Studio™ 2.0 on November 3, 2025. The new version of its open-source development platform is designed to make it easier and faster for developers to build AI-powered embedded systems that run on ADI’s processors and microcontrollers.
“The next era of embedded intelligence requires removing friction from AI development”, said Rob Oshana, Senior Vice President of the Software and Digital Platforms group at ADI. “CodeFusion Studio 2.0 transforms the developer experience by unifying fragmented AI workflows into a seamless process, empowering developers to leverage the full potential of ADI's cutting-edge products with ease so they can focus on innovating and accelerating time to market”.
The upgraded platform introduces new tools for hardware abstraction, AI integration and automation. These help developers move more easily from early design to deployment.
CodeFusion Studio 2.0 enables complete AI workflows, allowing teams to use their own models and deploy them on everything from low-power edge devices to advanced digital signal processors (DSPs).
Built on Microsoft Visual Studio Code, the new CodeFusion Studio offers built-in checks for model compatibility, along with performance testing and optimization tools that help reduce development time. Building on these capabilities, a new modular framework based on Zephyr OS lets developers test and monitor how AI and machine learning models perform in real time. This gives clearer insight into how each part of a model behaves during operation and helps fine-tune performance across different hardware setups.
Additionally, the CodeFusion Studio System Planner has also been redesigned to handle more device types and complex, multi-core applications. With new built-in diagnostic and debugging features — like integrated memory analysis and visual error tracking — developers can now troubleshoot problems faster and keep their systems running more efficiently.
This launch marks a deeper pivot for ADI. Long known for high-precision analog chips and converters, the company is expanding its edge-AI and software capabilities to enable what it calls Physical Intelligence — systems that can perceive, reason, and act locally.
“Companies that deliver physically aware AI solutions are poised to transform industries and create new, industry-leading opportunities. That's why we're creating an ecosystem that enables developers to optimize, deploy and evaluate AI models seamlessly on ADI hardware, even without physical access to a board”, said Paul Golding, Vice President of Edge AI and Robotics at ADI. “CodeFusion Studio 2.0 is just one step we're taking to deliver Physical Intelligence to our customers, ultimately enabling them to create systems that perceive, reason and act locally, all within the constraints of real-world physics”.
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The US$50.8 million deal strengthens TECO’s push into modular infrastructure and faster data center deployment across Southeast Asia.
Updated
May 26, 2026 5:39 PM
Kuala Lumpur, Malaysia. PHOTO: UNSPLASH
TECO Electric & Machinery is expanding further into Southeast Asia’s AI data center infrastructure market through a new acquisition in Malaysia.
The Taiwan-based company has signed an agreement to acquire approximately 78 percent of Malaysian engineering firm Dynaciate Engineering in a deal valued at around MYR 200 million (US$50.8 million). According to TECO, the acquisition is aimed at strengthening its modular data center manufacturing capabilities and supporting its expansion across Southeast Asia’s data center infrastructure sector.
Under the agreement, Dynaciate will become TECO’s global manufacturing hub for modular data center and power equipment products. The company will also serve as an engineering hub supporting TECO’s regional expansion efforts, particularly in AI data center infrastructure projects.
TECO Chairman Morris Li said the integration between both companies has improved execution efficiency and increased the company’s in-house modular prefabrication capabilities. According to the company, the collaboration has reduced data center delivery timelines to as little as six months.
Dynaciate is headquartered in Johor Bahru, Malaysia. Its facilities span approximately 36,000 square meters and include eight production buildings focused on stainless steel and carbon steel fabrication. The company said the site is also eligible for export tax incentives that support future global supply chain deployment.
According to TECO, Dynaciate has experience in engineering, steel fabrication and large-scale industrial projects for multinational corporations. The company added that Dynaciate has expanded into the data center engineering market since 2025 through projects involving international cloud service provider clients.
TECO estimates that after the acquisition, around 65 percent of future data center-related revenue will come from modular data centers and prefabricated products, while the remaining 35 percent will come from AI data center engineering projects. The company also forecasts that data center-related revenue within its Power & Energy Business Group will rise from below 10 percent to 30 percent this year.
Dynaciate CEO Ng Kim Thiea said the company is entering a new phase of growth through the partnership with TECO. He added that Dynaciate has extensive experience supporting engineering and industrial projects across the region.
The acquisition marks a further expansion of TECO’s presence in the AI data center infrastructure sector as companies continue increasing investments in modular infrastructure and regional engineering capacity.