A turbine-inspired generator shows how overlooked industrial airflow could quietly become a new source of usable power
Updated
February 12, 2026 4:43 PM
Campus building of Chung-Ang University. PHOTO: CHUNG-ANG UNIVERSITY
Compressed air is used across factories, data centers and industrial plants to move materials, cool systems and power tools. Once it has done that job, the air is usually released — and its remaining energy goes unused.
That everyday waste is what caught the attention of a research team at Chung-Ang University in South Korea. They are investigating how this overlooked airflow can be harnessed to generate electricity instead of disappearing into the background.
Most of the world’s power today comes from systems like turbines, which turn moving fluids into energy or solar cells, which convert sunlight into electricity. The Chung-Ang team has built a device that uses compressed air to generate electricity without relying on traditional blades or sunlight.
At the center of the work is a simple question: what happens when high-pressure air spins through a specially shaped device at very high speed? The answer lies in the air itself. The researchers found that tiny particles naturally present in the air carry an electric charge. When that air moves rapidly across certain surfaces, it can transfer charge without physical contact. This creates electricity through a process known as the “particulate static effect.”
To use that effect, the team designed a generator based on a Tesla turbine. Unlike conventional turbines with blades, a Tesla turbine uses smooth rotating disks and relies on the viscosity of air to create motion. Compressed air enters the device, spins the disks at high speed and triggers charge buildup on specially layered surfaces inside.
What makes this approach different is that the system does not depend on friction between parts rubbing together. Instead, the charge comes from particles in the air interacting with the surfaces as they move past. This reduces wear and allows the generator to operate at very high speeds. And those speeds translate into real output.
In lab tests, the device produced strong electrical power. The researchers also showed that this energy could be used in practical ways. It ran small electronic devices, helped pull moisture from the air and removed dust particles from its surroundings.
The problem this research is addressing is straightforward.
Compressed air is already everywhere in industry, but its leftover energy is usually ignored. This system is designed to capture part of that unused motion and convert it into electricity without adding complex equipment or major safety risks.
Earlier methods of harvesting static electricity from particles showed promise, but they came with dangers. Uncontrolled discharge could cause sparks or even ignition. By using a sealed, turbine-based structure, the Chung-Ang University team offers a safer and more stable way to apply the same physical effect.
As a result, the technology is still in the research stage, but its direction is easy to see. It points toward a future where energy is not only generated in power plants or stored in batteries, but also recovered from everyday industrial processes.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.