ICBC Asia's new competition gives Hong Kong students a chance to test their fintech ideas beyond the classroom.
Updated
October 2, 2026 9:16 AM
Main Building of the University of Hong Kong. PHOTO: ADOBE STOCK
Hong Kong university students are being invited to take part in the first Hong Kong University Students Fintech Innovation Competition, organised by Industrial and Commercial Bank of China (Asia). The competition gives students a chance to develop ideas around financial technology, with cash prizes, internship opportunities and a route to the national finals of the ICBC Cup on offer.
The competition is part of the 17th ICBC Cup and marks the first time ICBC has established a competition zone in Hong Kong. It is supported by the Financial Services and the Treasury Bureau and the Hong Kong Monetary Authority, with 12 Hong Kong universities also backing the initiative.
The participating universities are the University of Hong Kong, the Chinese University of Hong Kong, Hong Kong University of Science and Technology, Hong Kong Polytechnic University, City University of Hong Kong, Hong Kong Baptist University, Hong Kong Metropolitan University, Lingnan University, Hong Kong Shue Yan University, the Education University of Hong Kong, Hang Seng University of Hong Kong and St. Francis University.
For ICBC Asia, the competition is also intended to support the development of fintech in Hong Kong and expand the city's fintech talent pool. Dr. Liu Yagan, Chairman and Executive Director of Industrial and Commercial Bank of China (Asia), said the competition is designed to encourage students to develop practical applications for financial technology and explore new banking business models.
"This competition encourages university students across Hong Kong to propose practical solutions for fintech applications and banking business model innovation from the perspective of financial products and services, providing a platform for Hong Kong youth to connect with cutting-edge industries and unleash their innovative potential."
The initiative will also connect Hong Kong students with the wider ICBC Group. Liu said this would help deepen exchanges between young talent in Hong Kong and the Mainland.
The competition is open to full-time university students in Hong Kong and carries the theme "Digital Banking, Creating the Future." Students can develop ideas across 10 areas, ranging from fintech and digital finance to green finance, inclusive finance, pension finance and wealth management. The categories also include financial security services, specialised financial services, youth services and open innovation services.
The competition also offers cash prizes: the First Prize winner will receive HK$50,000; two Second Prize winners will receive HK$30,000 each; three Third Prize winners will receive HK$20,000 each; and four Honorable Mention recipients will receive HK$10,000 each.
Beyond the prize money, qualifying winners will have the opportunity to undertake internships at ICBC (Asia). The team that wins the Hong Kong First Prize will also have the opportunity to travel to Beijing in December for the ICBC Cup national finals, where it will compete against teams from across the country.
With registration now open, the competition gives Hong Kong university students an opportunity to take ideas in financial technology from the classroom into areas such as banking products, services and business models.
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Rethinking 3D modelling for a world that generates too much, too quickly.
Updated
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MicroCloud Hologram Inc. (NASDAQ: HOLO), a technology service provider recognized for its holography and imaging systems, is now expanding into a more advanced realm: a quantum-driven 3D intelligent model. The goal is to generate detailed 3D models and images with far less manual effort — a need that has only grown as industries flood the world with more visual data every year.
The concept is straightforward, even if the technology behind it isn’t. Traditional 3D modeling workflows are slow, fragmented and depend on large teams to clean datasets, train models, adjust parameters and fine-tune every output. HOLO is trying to close that gap by combining quantum computing with AI-powered 3D modeling, enabling the system to process massive datasets quickly and automatically produce high-precision 3D assets with much less human involvement.
To achieve this, the company developed a distributed architecture comprising of several specialized subsystems. One subsystem collects and cleans raw visual data from different sources. Another uses quantum deep learning to understand patterns in that data. A third converts the trained model into ready-to-use 3D assets based on user inputs. Additional modules manage visualization, secure data storage and system-wide protection — all supported by quantum-level encryption. Each subsystem runs in its own container and communicates through encrypted interfaces, allowing flexible upgrades and scaling without disrupting the entire system.
Why this matters: Industries ranging from gaming and film to manufacturing, simulation and digital twins are rapidly increasing their reliance on 3D content. The real bottleneck isn’t creativity — it’s time. Producing accurate, high-quality 3D assets still requires a huge amount of manual processing. HOLO’s approach attempts to lighten that workload by utilizing quantum tools to speed up data processing, model training, generation and scaling, while keeping user data secure.
According to the company, the system’s biggest advantages include its ability to handle massive datasets more efficiently, generate precise 3D models with fewer manual steps, and scale easily thanks to its modular, quantum-optimized design. Whether quantum computing will become a mainstream part of 3D production remains an open question. Still, the model shows how companies are beginning to rethink traditional 3D workflows as demand for high-quality digital content continues to surge.