ICBC Asia's new competition gives Hong Kong students a chance to test their fintech ideas beyond the classroom.
Updated
October 2, 2026 9:16 AM
Main Building of the University of Hong Kong. PHOTO: ADOBE STOCK
Hong Kong university students are being invited to take part in the first Hong Kong University Students Fintech Innovation Competition, organised by Industrial and Commercial Bank of China (Asia). The competition gives students a chance to develop ideas around financial technology, with cash prizes, internship opportunities and a route to the national finals of the ICBC Cup on offer.
The competition is part of the 17th ICBC Cup and marks the first time ICBC has established a competition zone in Hong Kong. It is supported by the Financial Services and the Treasury Bureau and the Hong Kong Monetary Authority, with 12 Hong Kong universities also backing the initiative.
The participating universities are the University of Hong Kong, the Chinese University of Hong Kong, Hong Kong University of Science and Technology, Hong Kong Polytechnic University, City University of Hong Kong, Hong Kong Baptist University, Hong Kong Metropolitan University, Lingnan University, Hong Kong Shue Yan University, the Education University of Hong Kong, Hang Seng University of Hong Kong and St. Francis University.
For ICBC Asia, the competition is also intended to support the development of fintech in Hong Kong and expand the city's fintech talent pool. Dr. Liu Yagan, Chairman and Executive Director of Industrial and Commercial Bank of China (Asia), said the competition is designed to encourage students to develop practical applications for financial technology and explore new banking business models.
"This competition encourages university students across Hong Kong to propose practical solutions for fintech applications and banking business model innovation from the perspective of financial products and services, providing a platform for Hong Kong youth to connect with cutting-edge industries and unleash their innovative potential."
The initiative will also connect Hong Kong students with the wider ICBC Group. Liu said this would help deepen exchanges between young talent in Hong Kong and the Mainland.
The competition is open to full-time university students in Hong Kong and carries the theme "Digital Banking, Creating the Future." Students can develop ideas across 10 areas, ranging from fintech and digital finance to green finance, inclusive finance, pension finance and wealth management. The categories also include financial security services, specialised financial services, youth services and open innovation services.
The competition also offers cash prizes: the First Prize winner will receive HK$50,000; two Second Prize winners will receive HK$30,000 each; three Third Prize winners will receive HK$20,000 each; and four Honorable Mention recipients will receive HK$10,000 each.
Beyond the prize money, qualifying winners will have the opportunity to undertake internships at ICBC (Asia). The team that wins the Hong Kong First Prize will also have the opportunity to travel to Beijing in December for the ICBC Cup national finals, where it will compete against teams from across the country.
With registration now open, the competition gives Hong Kong university students an opportunity to take ideas in financial technology from the classroom into areas such as banking products, services and business models.
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The collaboration between Oversonic Robotics and STMicroelectronics highlights how robotics is beginning to fill gaps traditional automation cannot.
Updated
January 23, 2026 10:41 AM
3D render of humanoid robots working in a factory assembly line. PHOTO: ADOBE STOCK
Oversonic Robotics, an Italian company known for building cognitive humanoid robots, has signed an agreement with STMicroelectronics, one of the world’s largest semiconductor manufacturers, to deploy humanoid robots inside semiconductor plants.
According to the companies, this is the first time cognitive humanoid robots will be used operationally inside semiconductor manufacturing facilities. And the first deployment has already taken place at ST’s advanced packaging and test plant in Malta.
At the center of the collaboration is RoBee, Oversonic’s humanoid robot. RoBee is designed to carry out support tasks within industrial environments, particularly where flexibility and interaction with human workers are required. In ST’s factories, the robots will assist with complex manufacturing and logistics flows linked to new semiconductor products. They are intended to work alongside existing automation systems, not replace them.
RoBee is notable for its ability to operate in environments shared with people. It is currently the only humanoid robot certified for use in both industrial and healthcare settings and is already in operation within several Italian companies. The robot is also being used in experimental hospital programs. That background helped position RoBee for deployment in tightly controlled manufacturing environments such as semiconductor plants.
Fabio Puglia, President of Oversonic Robotics, described the agreement as a milestone for deploying humanoid robots in complex industrial settings: “The partnership with STMicroelectronics is a great source of pride for us because it embodies the vision of cognitive robotics that Oversonic has brought to the industrial and healthcare markets. Being the first to introduce cognitive humanoid robots in a sophisticated production context such as semiconductors means measuring ourselves against the highest standards in terms of reliability, safety and operational continuity. This agreement represents a fundamental milestone for Oversonic and, more generally, for the industrial challenges these new machines are called to face in innovative and highly complex environments, alongside people and supporting their quality of work”.
From STMicroelectronics’ side, the use of humanoid robots is framed as part of a broader effort to manage growing manufacturing complexity. he company said RoBee will support complex tasks and help manage the intricate production flows required by newer semiconductor products. It is also expected to contribute to improved product quality and shorter manufacturing cycle times. The robots are designed to integrate with existing automation and software systems, helping improve safety and operational continuity.
In semiconductor manufacturing, precision and reliability leave little room for experimentation. Therefore, introducing humanoid robots into this environment signals a practical shift. It shows how robotics is starting to fill gaps that traditional automation has struggled to address.