Mainland giants accelerate expansion as local players face unprecedented competition.
Updated
January 8, 2026 6:34 PM
HKTV Mall in Amoy Plaza. PHOTO: WIKIPEDIA USER -WPCPEY
Hong Kong is entering a new phase of competition as mainland platforms accelerate their expansion into the city, turning it into a frontline testing ground for Chinese companies preparing to push into global markets. With retail, logistics and food-delivery businesses all reshaped in the past year, Hong Kong has become the closest international environment where mainland firms can experiment with pricing, supply chains and customer behaviour under a familiar regulatory and cultural framework.
The shift became especially clear this week. At HKTVmall’s Vision Day on November 11, 2025, CEO Ricky Wong warned that Hong Kong’s traditional retail model is facing its toughest moment yet. He said the biggest threat is not mainland competitors like Taobao, JD.com or Pinduoduo entering Hong Kong, but the city’s longstanding dependence on physical shopping. If local retailers do not evolve, he said, they risk becoming “very easy to die of thirst in the desert”. Wong even welcomed the rise of mainland e-commerce giants, arguing that the more players enter the city, the faster consumers will shift online — a transition HKTVmall relies on for growth.
Yet his optimism is layered over a challenging reality. HKTVmall’s own numbers reflect pressure from competition and changing consumer habits. The company reported average daily GMV of HK$22.2 million during the latest shopping festival season — up 2.8% month-on-month but still down 4.3% compared year-on-year — showing that even established online platforms are struggling to maintain momentum as mainland entrants squeeze prices and widen product selection.
The city’s food-delivery market illustrates the shift even more sharply. Deliveroo, once the fastest-growing platform in Hong Kong and at one point holding more than half of the market, officially shut down in April this year after a long decline. Its trajectory mirrored the sector’s upheaval: the company surged during the pandemic but lost ground after restrictions eased, first overtaken by Foodpanda and then pressured heavily by Meituan-backed Keeta, which entered Hong Kong in 2023 and quickly seized about 30% of citywide orders.
Deliveroo’s exit and the handover of parts of its business to Foodpanda did little to stabilise the market. Keeta’s rapid expansion instead pushed Foodpanda onto the defensive, leaving two major players competing in a market shaped by mainland-style pricing and operations. Hong Kong’s delivery sector, once dominated by global firms, is increasingly defined by Chinese platforms optimizing speed and efficiency at a scale few competitors can match.
These changes are unfolding as Chinese companies shift their focus toward new global markets.
With China reducing its reliance on the US and EU and exports steadily moving toward ASEAN, Hong Kong has become a strategic launchpad. The city’s proximity, language familiarity and regulatory structure make it the nearest international setting where Chinese firms can test overseas strategies before expanding into Southeast Asia, the Middle East or Latin America. The result is a competitive intensity that local companies have rarely experienced. Retailers face price pressure they can’t match, local platforms are losing ground to mainland giants and global players are struggling to stay in the game.
Consumers benefit from lower prices, faster delivery and wider choice — but for Hong Kong businesses, the landscape has turned unforgiving. Mainland companies are not treating Hong Kong as a final destination but as the first stop in a broader global push. That positioning is reshaping the city’s entire consumer economy. As more mainland firms look outward, Hong Kong’s role as a testing ground will only deepen and the first players to feel the impact will be those operating closest to the consumer.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.