From generative AI to green energy, 15 finalist teams will take the stage after a record 390 teams entered this year's competition.
Updated
October 2, 2026 9:13 AM
Entrance Piazza, Hong Kong University of Science and Technology. PHOTO: HKUST
The HKUST-Sino Million Dollar Entrepreneurship Competition 2026 will hold its finals on October 12, following a record 390 teams from 24 countries and regions taking part in this year's competition.
Jointly organised by the Hong Kong University of Science and Technology (HKUST) and Sino Group, the competition aims to give young entrepreneurs a platform to develop and present their ideas. Sino Group Deputy Chief Executive Officer Wong Wing-lung said the Group has partnered with HKUST for many years to support young talent and the development of innovation and technology in Hong Kong.
He said the competition gives young entrepreneurs a platform to showcase their creativity, exchange ideas and put their concepts into practice.
The international participation is reflected in the universities and regions represented this year. Participants include students from the University of Oxford in the UK, the University of Pennsylvania in the US and the National University of Singapore. Teams have also joined from Australia and South Africa.
After multiple rounds of assessment, 15 teams have advanced to the finals. Their projects cover health technology, generative AI, smart buildings, and green energy management. At the finals, the teams will present their solutions to a judging panel comprising venture capital investors, industry leaders and academic experts. They will compete for more than HK$1 million in prizes and awards.
The 2026 competition has also expanded the areas it recognises. Three new awards have been introduced this year: the Transformative AI Award, the NextGen Biotech Award and the Societal Influential Award. The competition will also continue to offer the Sustainability Impact Award. Together, the awards focus on areas ranging from emerging technologies to social and sustainability challenges.
The organisers are also adding new activities to help teams develop their ideas further. This year's programme includes pitching skills training, AI workshops, investor matching sessions and mentorship opportunities. The AI workshops will cover areas including generative AI and AI agents, while representatives from venture capital firms such as Gobi Partners and InnoAngel Fund have been invited to share insights on fundraising, product positioning and market expansion.
These activities are intended to help young entrepreneurs strengthen their business plans and presentation skills. They also give teams opportunities to explore technology commercialisation and potential market applications.
The competition will also launch the InnoBay 1M PLUS Program during the Grand Final. The programme will focus initially on Smart City Development and aims to connect HKUST start-ups and competition alumni with industry partners. It will also support potential proof-of-concept opportunities and help promising innovations move towards commercial adoption.
The Grand Final will also include an audience voting segment. Members of the public will be able to vote for the team they believe has the greatest potential and impact, with those who correctly vote for an eventual winning team entering a lucky draw.
For Wong, the competition is part of a broader effort to develop Hong Kong's innovation and technology talent. He noted that Hong Kong's first Five-Year Plan and latest Policy Address both highlight innovation, technology and talent development.
Prof. Tim Cheng Kwang-Ting, HKUST's Vice-President for Research and Development, said the competition has also served as a platform for aspiring entrepreneurs to connect with investors, understand market needs, test their ideas and gain practical entrepreneurial experience. He added that the competition has strengthened its training, mentorship and networking activities this year.
The Group believes that closer cooperation between industry, academia and research institutions can help turn innovative ideas into practical applications. Through the competition and its wider support programmes, young entrepreneurs are given opportunities to develop their ideas, connect with potential partners and explore how they can be taken from early concepts towards real-world applications.
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The hidden cost of scaling AI: infrastructure, energy, and the push for liquid cooling.
Updated
January 8, 2026 6:31 PM
The inside of a data centre, with rows of server racks. PHOTO: FREEPIK
As artificial intelligence models grow larger and more demanding, the quiet pressure point isn’t the algorithms themselves—it’s the AI infrastructure that has to run them. Training and deploying modern AI models now requires enormous amounts of computing power, which creates a different kind of challenge: heat, energy use and space inside data centers. This is the context in which Supermicro and NVIDIA’s collaboration on AI infrastructure begins to matter.
Supermicro designs and builds large-scale computing systems for data centers. It has now expanded its support for NVIDIA’s Blackwell generation of AI chips with new liquid-cooled server platforms built around the NVIDIA HGX B300. The announcement isn’t just about faster hardware. It reflects a broader effort to rethink how AI data center infrastructure is built as facilities strain under rising power and cooling demands.
At a basic level, the systems are designed to pack more AI chips into less space while using less energy to keep them running. Instead of relying mainly on air cooling—fans, chillers and large amounts of electricity, these liquid-cooled AI servers circulate liquid directly across critical components. That approach removes heat more efficiently, allowing servers to run denser AI workloads without overheating or wasting energy.
Why does that matter outside a data center? Because AI doesn’t scale in isolation. As models become more complex, the cost of running them rises quickly, not just in hardware budgets, but in electricity use, water consumption and physical footprint. Traditional air-cooling methods are increasingly becoming a bottleneck, limiting how far AI systems can grow before energy and infrastructure costs spiral.
This is where the Supermicro–NVIDIA partnership fits in. NVIDIA supplies the computing engines—the Blackwell-based GPUs designed to handle massive AI workloads. Supermicro focuses on how those chips are deployed in the real world: how many GPUs can fit in a rack, how they are cooled, how quickly systems can be assembled and how reliably they can operate at scale in modern data centers. Together, the goal is to make high-density AI computing more practical, not just more powerful.
The new liquid-cooled designs are aimed at hyperscale data centers and so-called AI factories—facilities built specifically to train and run large AI models continuously. By increasing GPU density per rack and removing most of the heat through liquid cooling, these systems aim to ease a growing tension in the AI boom: the need for more computers without an equally dramatic rise in energy waste.
Just as important is speed. Large organizations don’t want to spend months stitching together custom AI infrastructure. Supermicro’s approach packages compute, networking and cooling into pre-validated data center building blocks that can be deployed faster. In a world where AI capabilities are advancing rapidly, time to deployment can matter as much as raw performance.
Stepping back, this development says less about one product launch and more about a shift in priorities across the AI industry. The next phase of AI growth isn’t only about smarter models—it’s about whether the physical infrastructure powering AI can scale responsibly. Efficiency, power use and sustainability are becoming as critical as speed.