Quantara AI launches a continuous platform designed to estimate the financial impact of cyber risk as companies move beyond periodic assessments
Updated
March 17, 2026 1:02 AM
A person tightrope walking between two cliffs. PHOTO: UNSPLASH
Cyber risk is increasingly treated as a financial issue. Boards want to know how much a cyber incident could cost the company, how it could affect earnings, and whether current security spending is justified.
Yet many organizations still measure cyber risk through periodic reviews. These assessments are often conducted once or twice a year, supported by consultants and spreadsheet models. By the time the report reaches senior leadership, the company’s systems may have changed and new threats may have emerged. The way risk is measured does not always match how quickly it evolves.
This gap is where Quantara AI is positioning its new platform. Quantara AI, a Boise-based cybersecurity startup, has introduced what it describes as the industry’s first persistent AI-powered cyber risk solution. The system is designed to run continuously rather than rely on occasional assessments.
The company’s core argument is straightforward: not every security weakness carries the same financial consequence. Instead of ranking issues only by technical severity, the platform analyzes active threats, identifies which company systems are exposed, and estimates how much money a successful attack could cost. It uses statistical models, including Value at Risk (VaR), to calculate potential losses. It also estimates how specific security improvements could reduce that projected loss.
The timing aligns with a broader market shift. International Data Corporation (IDC) projects that by 2028, 40% of enterprises will adopt AI-based cyber risk quantification platforms. These tools convert security data into financial estimates that can guide budgeting and investment decisions. The forecast reflects growing pressure on security leaders to present risk in terms that boards and regulators understand.
Traditional compliance and risk management systems often focus on meeting regulatory standards. Vulnerability management programs typically score weaknesses based on technical characteristics. Consultant-led risk studies provide detailed analysis, but they are usually performed at set intervals. In fast-changing threat environments, that model can leave decision-makers working with outdated information.
Quantara’s platform attempts to replace that periodic process with continuous measurement. It brings together threat data, internal system information and financial modeling in one system. The goal is to show, at any given time, which specific weaknesses could lead to the largest financial losses.
Cyber risk quantification as a concept is not new. What is changing is the expectation that these calculations be updated regularly and tied directly to financial decision-making. As cyber incidents carry clearer monetary consequences, companies are looking for ways to measure exposure with greater precision.
The broader question is whether enterprises will shift fully toward continuous, AI-driven risk analysis or continue relying on periodic external assessments. What is clear is that cybersecurity discussions are moving closer to financial reporting — and tools that estimate potential loss in dollar terms are becoming central to that shift.
Keep Reading
AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.