Discus Fish of Cobo and Samuel Tse of Animoca Brands discuss how AI agents, digital identity and blockchain could change the way money moves.
Updated
November 2, 2026 12:03 PM
The Agentic Economy Summit at CVCF 2026 explores how AI agents and digital assets could shape the future of business and finance. IMAGE: CYBERPORT
For an AI agent to manage money on someone’s behalf, it needs more than the ability to follow instructions. It must be able to establish whom it represents, access funds and transact within agreed limits.
These are among the questions informing the discussion of AI and digital assets at Cyberport Venture Capital Forum (CVCF) 2026. Ahead of the forum, Discus Fish, CEO and Co-founder of Cobo, and Samuel Tse, Head of Investment and Corporate Finance at Animoca Brands, shared their views on how this convergence could develop—and where they see opportunities for businesses.
Discus Fish points to a longstanding challenge: blockchain can be difficult for everyday users to navigate, but AI agents may find it easier to interact with these networks.
“Blockchains have always been hard for ordinary people to use. AI agents may be better users: the chain is fully transparent and every record is traceable, which suits agents well.”
His outlook comes with a qualification. Both the agents and the networks they would use still need to develop.
“Agents aren’t capable enough yet, and chains are still adapting. But once agents truly run on-chain, the number of users and what’s possible will grow by an order of magnitude.”
Discus Fish says blockchain could reshape how financial assets are issued, traded and settled over the next five years. He also notes that institutional adoption has progressed faster than Cobo initially expected, with individual users no longer leading the shift. “Since 2017, we have believed blockchain will become part of the financial infrastructure of the future. We expected individual users to lead, but institutions moved faster.”
For Fish, the next stage involves a broader range of assets and financial clients.
“What gets redefined next is how assets are issued, traded, and settled. As traditional assets like US equities come on-chain, a much wider range of financial clients will follow.”
Samuel Tse, Head of Investment and Corporate Finance at Animoca Brands, focuses on investment opportunities across digital assets and agentic AI. He sees digital identity as essential to allowing AI agents to act on behalf of people while keeping transactions within the permissions they set.
He believes users should set clear rules for what an AI agent can do, allowing it to complete transactions without requiring approval for each one.
“Once agents can prove who they represent, hold digital assets, and move value under clear rules, the economy stops being click-by-click. You set the policy once—who, how much, for what—and the agent transacts inside it.”
He describes applications ranging from everyday payments and transfers to subscriptions, swaps and earning returns on idle funds. “That’s agentic transactions: payments, transfers, subscriptions, swaps, even chasing a better rate on idle cash. Identity is the trust layer. Assets and credentials are the spending authority—always accountable to the human who granted permission.”
In Tse’s account, the human remains the source of that authority. The agent acts within the permissions granted to it.
To illustrate how AI agents, digital identity and digital assets might work together, Tse offers a hypothetical Hong Kong parent's weekday.
“A Hong Kong parent’s weekday: top up the child’s Octopus, book a weekend football slot, translate a school notice for the helper, check weather before pickup, restock milk at the member price, and keep leftover budget earning until tomorrow.”
At present, he says, completing these tasks requires navigating services that often operate separately.
“Today that means many apps that don't talk to each other, and rails that struggle with micro payments.”
His proposed alternative brings the tasks together under instructions established by the user.
“With an agent, they set the rules once and let it decide what to do. Identity unlocks trust and member prices without oversharing. Digital assets fit the money—per-use fees, hard limits, yield until spend.”
For Tse, this combination could create opportunities across payments, merchants, identity providers and digital-asset platforms. He compares the potential scale of agentic commerce to an earlier change in how consumers accessed services.
“The iPhone in 2007 rewired how people buy and use services for 20 years. We are just at the beginning of a similar paradigm shift, with outcomes we can barely imagine.”
Discus Fish and Samuel Tse offer two perspectives on the emerging agentic economy, from the blockchain infrastructure enabling transactions to the digital identity and permissions that allow AI agents to act on people's behalf. At CVCF 2026, these ideas will become part of a wider conversation with the leaders building and investing in this evolving space.
Be part of the conversation. Join industry leaders, founders and investors at CVCF 2026 on 4–5 November and explore the technologies and opportunities shaping the next phase of business.
Exclusive for Ventureport readers: Use code cvcf26vp to access a Full Access Pass for HK$300, subject to confirmation by the organiser.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
August 10, 2026 5:56 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.