AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.
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WIRobotics is betting that years of real-world movement data could shape the next generation of humanoid robots
Updated
May 19, 2026 5:10 PM
3D render of a person in various colours. PHOTO: UNSPLASH
Investor interest in humanoid robotics is continuing to grow as startups race to build systems capable of working alongside humans in real-world environments. That momentum was reflected after WIRobotics announced a KRW 95 billion (USD 68 million) Series B funding round to accelerate development of its humanoid robotics platform, ALLEX.
The Seoul-based startup said the funding comes roughly two years after its KRW 13 billion Series A round in 2024. JB Investment led the financing alongside investors including InterVest, Hana Ventures, Smilegate Investment, SBVA, NH Investment & Securities, Company K Partners, GU Investment and FuturePlay.
WIRobotics has spent the past several years building wearable robotics systems designed to assist human movement. The startup is now using that foundation to expand deeper into humanoid robotics and Physical AI, a category focused on AI systems that can interact with the physical world through movement, perception and manipulation.
Its humanoid platform, ALLEX, is being developed to support human-level object manipulation and interaction capabilities. The startup was recently selected for NVIDIA’s Physical AI Fellowship, a global robotics and AI development initiative aimed at supporting next-generation robotics research.
Rather than building humanoid systems entirely from scratch, WIRobotics is drawing on movement data collected through its wearable walking-assist robot, WIM. Over the past three years, the startup says it has built large real-world datasets around gait patterns, mobility and human movement control.
That wearable robotics business has also started showing commercial traction. WIM has sold more than 3,000 cumulative units and expanded into overseas markets including Europe, China, Türkiye and Japan. Revenue grew from KRW 560 million in 2023 to KRW 1.3 billion in 2024, then to KRW 2.79 billion in 2025. According to the startup, first-quarter 2026 revenue has already surpassed its full-year 2024 total.
The startup believes that real-world movement data collected through wearable robotics could become a competitive advantage as humanoid systems move closer to commercial deployment. WIRobotics is also expanding its global footprint alongside its robotics development efforts. The startup said it is establishing a North American entity in California while growing partnerships with overseas distributors and healthcare networks.
Its humanoid ambitions are moving into a more operational phase as well. Beginning later this year, WIRobotics plans to supply a research-focused version of its Mobile ALLEX platform to global research institutions and international partners for testing and collaborative development. The startup is also in discussions with a global automotive manufacturer around manufacturing-focused platform validation projects.
Yeonbaek Lee said: "This investment represents global recognition that the real-world movement data and control technologies accumulated through wearable robotics can evolve into next-generation humanoid robotics. We aim to accelerate the arrival of humanoid robots capable of interacting naturally with people".
Yongjae Kim added: "All investors from our previous Series A round participated again in this Series B financing, demonstrating strong confidence in WIRobotics' technological capabilities and growth potential amid intensifying global humanoid competition. Our mission is to realize humanoids capable of fundamentally human-like interaction and force control, driving a paradigm shift in high-performance manipulation technologies".
As competition intensifies across humanoid robotics, startups are increasingly trying to differentiate themselves through real-world deployment data rather than simulation alone. WIRobotics is positioning its wearable robotics business as the foundation for that transition, betting that years of human movement data could help shape the next generation of humanoid systems.