AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.
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A wearable ring, conversational AI and US$23M in funding. Sandbar wants to rethink how we interact with technology
Updated
April 1, 2026 8:55 AM
Sandbar's Stream ring. PHOTO: SANDBAR
Sandbar, a New York–based interface startup, has raised US$23 million in Series A funding to develop a wearable device that lets people interact with artificial intelligence via voice rather than screens.
Adjacent and Kindred Ventures led the round; both venture firms focused on early-stage technology startups. The investment brings Sandbar’s total funding to us$36 million. Earlier backing included a US$10 million seed round led by True Ventures, a venture capital firm, as well as a US$3 million pre-seed round supported by Upfront Ventures, a venture firm and Betaworks, a startup studio and investment firm.
Sandbar was founded by Mina Fahmi and Kirak Hong, who previously worked together at CTRL-labs, a neural interface startup acquired by Meta in 2019. Their earlier work explored how computers could respond more directly to human intent — an idea that continues to shape Sandbar’s approach to AI interfaces.
The new funding will help the company expand its team across machine learning, interaction design and software engineering as it prepares to launch its first product. That product, called Stream, combines a wearable ring with a conversational AI interface. The system allows users to speak to an AI assistant without unlocking a phone or opening an app.
The concept is simple. Instead of typing into a screen, users press a button on the ring and talk. The system can capture notes, organize ideas, retrieve information from the web or trigger actions through connected applications.
The ring includes a microphone, a touchpad and subtle haptic feedback. These elements allow the device to respond through gentle vibrations rather than visual alerts. According to the company, the ring only listens when the user presses the button — a design meant to address common concerns around always-on microphones.
That design reflects a larger shift Sandbar believes is underway. As AI assistants become more capable, many startups are experimenting with new ways to interact with them. The focus is moving away from screens and keyboards toward interfaces that feel more natural and immediate.
Stream uses multiple AI models working together to process requests, search the web and structure information in real time. The company says users remain in control of their data and can choose whether to share information with other apps.
Sandbar is also developing a feature called Inner Voice, which responds using a voice customized to the user. The feature will debut during a closed beta planned for this spring, giving the company time to refine how the software behaves in everyday use.
The startup currently employs a team of 15 people. Many have worked on well-known consumer devices including the iPhone, Fitbit, Kindle and Vision Pro. Recent hires include Sam Bowen, formerly of Amazon and Fitbit, who joined as vice president of hardware and Brooke Travis, previously at Equinox, Dior and Gap, who now leads marketing.
Sandbar plans to begin shipping Stream in summer 2026 after completing early testing. As artificial intelligence tools become more integrated into daily life, the company is betting that the next shift in computing will not come from another app — but from new ways for people to interact with AI itself.