Humanoids are moving from research labs into real industries — and capital is finally catching up.
Updated
January 8, 2026 6:31 PM
A face of a humanoid robot, side view on black background. PHOTO: UNSPLASH
Humanoid robots are shifting from sci-fi speculation to engineering reality, and the pace of progress is prompting investors to reassess how the next decade of physical automation will unfold. ALM Ventures has launched a new US$100 million early-stage fund aimed squarely at this moment—one where advances in robot control, embodied AI and spatial intelligence are beginning to converge into something commercially meaningful.
ALM Ventures Fund I, is designed for the earliest stages of company formation, targeting seed and pre-seed teams building the foundations of humanoid deployment. It’s a concentrated fund that seeks to take early ownership in a sector that many now consider the next major technological frontier.
For Founder and General Partner Modar Alaoui, the timing is not accidental. “After years of research, humanoids are finally entering a phase where performance, reliability and cost are converging toward commercial viability”, he said. “What the category needs now is focused capital and deep technical diligence to turn prototypes into scalable, enduring companies”.
That framing captures a shift happening across robotics: the field is moving out of the lab and into early commercial readiness. Improvements in perception systems, model-based reasoning and motion control are accelerating the transition. Advances in simulation are also lowering the complexity and cost of integrating humanoid platforms into real environments. As these systems become more capable, the gap between research prototypes and market-ready products is narrowing.
ALM Ventures is positioning itself at this inflection point. Fund I’s thesis centers on the core technologies required to scale humanoids safely and economically. This includes next-generation robot platforms, spatial reasoning engines, embodied intelligence models, world-modeling systems and the infrastructure needed for early deployment. Rather than chasing every robotics trend, the fund is concentrating on the essential layers that will determine whether humanoids can work reliably outside controlled settings.
The firm isn’t starting from zero. During the fund’s formation, ALM Ventures made ten early investments that directly align with its investment focus. The portfolio includes companies building at different layers of the humanoid stack, such as Sanctuary AI, Weave Robotics, Emancro, High Torque Robotics, MicroFactory, Mbodi, Adamo, Haptica Robotics, UMA and O-ID. The list reflects a broad but intentional spread, from hardware to intelligence to manufacturing approaches, all oriented toward enabling scalable physical AI.
Beyond capital, ALM Ventures has been shaping the ecosystem through its global Humanoids Summit series in Silicon Valley, London and Tokyo. The series gives the firm early visibility into emerging technologies, pre-incorporation teams and the senior leaders steering the global robotics landscape. That vantage point has helped the firm identify where commercialization is truly taking root and where bottlenecks still exist.
The rise of humanoids is often compared to the early days of self-driving cars: a long arc of research suddenly meeting an acceleration point. What separates this moment is that advances in embodied AI and spatial intelligence are giving robots a more intuitive understanding of the physical world, making them easier to deploy, teach and scale. ALM Ventures’ Fund I is an attempt to capture that transition while shaping the companies that could define the next technological era.
With US$100 million dedicated to the earliest builders in the space, ALM Ventures is signaling its belief that humanoids are not just another robotics cycle—they may be the next major platform shift in AI.
Keep Reading
AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.