Inside a partnership showing how open-source platforms and startups are scaling autonomous driving beyond the lab.
Updated
January 8, 2026 6:30 PM
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A Robotaxi prototype developed by TIER IV. PHOTO: TIER IV
Autonomous driving is often discussed in terms of futuristic cars and distant timelines. This investment is about something more immediate. Japan-based TIER IV has invested in Turing Drive, a Taiwan startup that builds autonomous driving systems designed for controlled, everyday environments such as factories, ports, airports and industrial campuses. The investment establishes a capital and business alliance between the two companies, with a shared focus on developing autonomous driving technology and expanding operations across Asia.
Rather than targeting open roads and city traffic, Turing Drive’s work centres on places where vehicles follow fixed routes and move at low speeds. These include logistics hubs, manufacturing facilities and commercial sites where automation is already part of daily operations. According to the release, Turing Drive has deployments across Taiwan, Japan and other regions and works closely with vehicle manufacturers to integrate autonomous systems into special-purpose vehicles.
The investment also connects Turing Drive more closely with Autoware, an open-source autonomous driving software ecosystem supported by TIER IV. Turing Drive joined the Autoware Foundation in September 2024 and develops its systems using this shared software framework. TIER IV’s own Pilot.Auto platform, which is built around Autoware, is used across applications such as factory transport, public transit, freight movement and autonomous mobility services.
Through the alliance, TIER IV plans to work with Turing Drive to further develop autonomous driving systems for these controlled environments, while strengthening its presence in Taiwan and the broader Asia-Pacific region. The collaboration brings together software development and on-the-ground deployment experience within markets where autonomous driving is already being tested in real operational settings.
“This partnership with Turing Drive represents a significant step forward in accelerating the deployment of autonomous driving across Asia”, said TIER IV CEO Shinpei Kato. “At TIER IV, our mission has always been to make autonomous driving accessible to all. By collaborating with Turing Drive, which has demonstrated remarkable achievements in real-world deployments in Taiwan, we aim to deliver autonomous driving that enables a safer, more sustainable and more inclusive society”.
“We are thrilled to establish this strategic alliance with TIER IV, a global leader in open-source autonomous driving”, said Weilung Chen, chairman of Turing Drive. “In Taiwan, autonomous driving deployment is gaining significant momentum, particularly across logistics hubs, ports, airports and industrial campuses. By combining our field expertise with TIER IV's world-class Pilot.Auto platform, we aim to accelerate the development of practical, commercially viable mobility services powered by autonomous driving”. Overall, the investment highlights how autonomous driving in Asia is being shaped by operational needs and gradual integration, rather than headline-grabbing demonstrations.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.