What Happens When AI Writes the Wrong References?

It’s no surprise that artificial intelligence, while remarkably capable, can also go astray—spinning convincing but entirely fabricated narratives. From politics to academia, AI’s “hallucinations” have repeatedly shown how powerful technology can go off-script when left unchecked.

Take Grok-2, for instance. In July 2024, the chatbot misled users about ballot deadlines in several U.S. states, just days after President Joe Biden dropped his re-election bid against former President Donald Trump. A year earlier, a U.S. lawyer found himself in court for relying on ChatGPT to draft a legal brief—only to discover that the AI tool had invented entire cases, citations and judicial opinions. And now, the academic world has its own cautionary tale.

Recently, a journal paper from the Department of Social Work and Social Administration at the University of Hong Kong was found to contain fabricated citations—sources apparently created by AI. The paper, titled “Forty Years of Fertility Transition in Hong Kong,” analyzed the decline in Hong Kong’s fertility rate over the past four decades. Authored by doctoral student Yiming Bai, along with Yip Siu-fai, Vice Dean of the Faculty of Social Sciences and other university officials, the study identified falling marriage rates as a key driver behind the city’s shrinking birth rate. The authors recommended structural reforms to make Hong Kong’s social and work environment more family-friendly.

But the credibility of the paper came into question when inconsistencies surfaced among its references. Out of 61 cited works, some included DOI (Digital Object Identifier) links that led to dead ends, displaying “DOI Not Found.” Others claimed to originate from academic journals, yet searches yielded no such publications.

Speaking to HK01, Yip acknowledged that his student had used AI tools to organize the citations but failed to verify the accuracy of the generated references. “As the corresponding author, I bear responsibility”, Yip said, apologizing for the damage caused to the University of Hong Kong and the journal’s reputation. He clarified that the paper itself had undergone two rounds of verification and that its content was not fabricated—only the citations had been mishandled.

Yip has since contacted the journal’s editor, who accepted his explanation and agreed to re-upload a corrected version in the coming days. A formal notice addressing the issue will also be released. Yip said he would personally review each citation “piece by piece” to ensure no errors remain.

As for the student involved, Yip described her as a diligent and high-performing researcher who made an honest mistake in her first attempt at using AI for academic assistance. Rather than penalize her, Yip chose a more constructive approach, urging her to take a course on how to use AI tools responsibly in academic research.

Ultimately, in an age where generative AI can produce everything from essays to legal arguments, there are two lessons to take away from this episode. First, AI is a powerful assistant, but only that. The final judgment must always rest with us. No matter how seamless the output seems, cross-checking and verifying information remain essential. Second, as AI becomes integral to academic and professional life, institutions must equip students and employees with the skills to use it responsibly. Training and mentorship are no longer optional; they’re the foundation for using AI to enhance, not undermine, human work.

Because in this age of intelligent machines, staying relevant isn’t about replacing human judgment with AI, it’s about learning how to work alongside it.

Keep Reading

Artificial Intelligence

AMD’s US$10 Billion Taiwan Expansion Signals a New Race for AI Infrastructure Scale

AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.

Ventureport Media Team

Updated

May 26, 2026 5:28 PM

Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH

As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.

The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.

The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.

AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.

The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.

At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.

Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.

Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.

Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.

Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.

AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.