New funding and ad support aim to ease capital gaps for small wedding businesses
Updated
March 17, 2026 1:01 AM
Mannequins display white wedding dresses in a bridal shop window. PHOTO: ADOBE STOCK
The Knot Worldwide, a global wedding technology platform and vendor marketplace, has launched a new grant initiative aimed at small businesses in the wedding industry.
The company, which operates brands such as The Knot and WeddingWire, connects couples with wedding professionals and provides tools to help vendors grow. It says the new WeddingPro Grant Program is designed to address a persistent challenge in the sector: access to capital.
Under the program, up to US$500,000 will be distributed to U.S.-based wedding professionals who run small businesses. The support will come in the form of financial grants, advertising credits on WeddingPro and mentorship. Selected businesses will also receive access to education resources and community support through the company’s network.
The move comes at a time when many wedding businesses remain small and resource-constrained. According to the company’s State of the Vendor Report, more than half of wedding businesses employ fewer than ten people. Three in four professionals surveyed said adaptability is critical to long-term success, while flexible funding remains a barrier. The grant program is positioned as a response to that funding gap.
“Our mission at The Knot Worldwide is to help the nearly 900,000 small businesses on our global platforms get discovered through our centralized vendor marketplace as well as give them the tools and resources to grow their business,” said Raina Moskowitz, Chief Executive Officer, The Knot Worldwide. “We consistently hear from our wedding professionals that access to capital is a barrier to getting started in the industry. With our new WeddingPro Grant Program, we will provide access to both capital and critical support services such as mentorship and education that will enable small business owners to further grow and scale.”
The application window opens on February 23 and closes on March 27. Winners are expected to be notified by May 2026, subject to eligibility verification and compliance with the official rules.
The program is open to U.S. wedding professionals who operate small businesses, have been in business for at least six months, can demonstrate an active revenue stream and earn at least 50% of their revenue from weddings. Applicants must submit a short form and a video outlining their business and how they would use the grant funds over the next 12 to 24 months. They can choose whether they prefer a monetary grant or free advertising support on WeddingPro.
To execute the program, The Knot Worldwide has partnered with the Global Entrepreneurship Network, which works with entrepreneurs worldwide. The company says the initiative builds on earlier efforts to support vendors on its platform, which includes about 200,000 wedding professionals in the United States. Its impact will depend on how effectively the support reaches the businesses that need it most. The real measure will be whether it helps them achieve steady, sustainable growth.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.