As global financial landscapes shift, Noah outlines a new AI-first approach to helping families protect and grow their wealth.
Updated
January 8, 2026 6:31 PM

Noah’s Black Diamond Summit. PHOTO: ARK WEALTH
Noah Holdings, one of Asia’s leading wealth management firms serving global Chinese high-net-worth families, hosted its annual Black Diamond Summit in Macau from December 7–11. The city has become a significant gathering place for Noah’s community, where clients, partners, and experts converge each year to explore how global trends are transforming wealth and family life. This year’s theme, “AI Together, Co-Generating the Future”, set the tone for a conversation about how modern wealth management must adapt in an age defined by artificial intelligence.
More than 3,000 attendees joined discussions that connected technology, global mobility, and long-term family planning. The Summit built on earlier sessions held in Shanghai, creating a continuous dialogue around one central question: how can families prepare for a world that is becoming more digital, more complex and more interconnected?
A major moment came when Noah introduced “Noya”, its new AI Relationship Manager. Noya is now part of the upgraded iARK Hong Kong and Singapore apps. It is built to support licensed human advisors, not replace them. The goal is simple: combine human judgment with AI intelligence to help clients understand their wealth more clearly and manage it across borders. Noya offers real-time insights, deeper personalisation, cleaner access to global financial information, smoother coordination between regions, and end-to-end execution through Noah’s global booking centres.
The Summit’s tone shifted toward long-term thinking when Co-Founder and Chairwoman Norah Wang delivered her keynote, “From Chaos to Clarity: Building a Global Operating System for Wealth Management”. She reflected on twenty years of serving more than 400,000 clients and explained that families today face new pressures. As she put it, “The real pain point for Chinese families today is not investment performance, but navigating the growing complexities of a global lifestyle”. Her message was straightforward: wealth is no longer just about returns. It is about managing uncertainty in a world where technology, geopolitics, and mobility collide.
Wang described how two major shifts have shaped modern wealth—first the Internet Era, which changed how people built wealth, and now what she calls the AI Civilisation Era, which is changing how people must protect it. She outlined the forces that influence today’s decisions: geopolitical shifts, persistent inflation, the rising importance of security and supply-chain technologies, the spread of AI, and the need for stronger family governance across generations. Each of these factors adds complexity, and families need tools that help them see the bigger picture.
To respond to this reality, Noah presented its integrated global wealth infrastructure. It is built on three pillars:
Together, these pillars function as an AI-supported system designed to simplify global complexity and help families preserve long-term stability.
One of the most discussed conversations featured Noah’s CEO, Zander Yin, and Tony Shale, Co-Founder & Chairman of Asian Private Banker China. They spoke about how AI is transforming private banking in Asia. Their view was that wealth management is moving from a product-centred model to one led by insight, trust, and human-tech collaboration. AI may accelerate analysis, but human expertise will continue to guide judgment, relationships, and long-term strategy.
The closing message of the Summit centred on redefining what prosperity means in an AI-driven age. For Noah, wealth is no longer a destination. It is an ongoing journey through a world that is increasingly fast-moving and unpredictable. As Wang noted, “With AI reshaping the very foundations of civilisation, wealth and financial freedom represent not a static endpoint, but a continuous journey. Here, we find our purpose: to help global Chinese investors navigate an increasingly complex world and achieve true prosperity, supported by resilient wealth management infrastructure and deep human expertise”.
The Summit ended on that note—a reminder that the future of wealth is not only about financial assets, but about clarity, confidence and the ability to adapt as the world transforms.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM

Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.