From information gaps to global access — how AI is reshaping the pursuit of knowledge.
Updated
January 8, 2026 6:33 PM
.jpg)
Paper cut-outs of robots sitting on a pile of books. PHOTO: FREEPIK
Encyclopaedias have always been mirrors of their time — from heavy leather-bound volumes in the 19th century to Wikipedia’s community-edited pages online. But as the world’s information multiplies faster than humans can catalogue it, even open platforms struggle to keep pace. Enter Botipedia, a new project from INSEAD, The Business School for the World, that reimagines how knowledge can be created, verified and shared using artificial intelligence.
At its core, Botipedia is powered by proprietary AI that automates the process of writing encyclopaedia entries. Instead of relying on volunteers or editors, it uses a system called Dynamic Multi-method Generation (DMG) — a method that combines hundreds of algorithms and curated datasets to produce high-quality, verifiable content. This AI doesn’t just summarise what already exists; it synthesises information from archives, satellite feeds and data libraries to generate original text grounded in facts.
What makes this innovation significant is the gap it fills in global access to knowledge. While Wikipedia hosts roughly 64 million English-language entries, languages like Swahili have fewer than 40,000 articles — leaving most of the world’s population outside the circle of easily available online information. Botipedia aims to close that gap by generating over 400 billion entries across 100 languages, ensuring that no subject, event or region is overlooked.
"We are creating Botipedia to provide everyone with equal access to information, with no language left behind", says Phil Parker, INSEAD Chaired Professor of Management Science, creator of Botipedia and holder of one of the pioneering patents in the field of generative AI. "We focus on content grounded in data and sources with full provenance, allowing the user to see as many perspectives as possible, as opposed to one potentially biased source".
Unlike many generative AI tools that depend on large language models (LLMs), Botipedia adapts its methods based on the type of content. For instance, weather data is generated using geo-spatial techniques to cover every possible coordinate on Earth. This targeted, multi-method approach helps boost both the accuracy and reliability of what it produces — key challenges in today’s AI-driven content landscape.
Additionally, the innovation is also energy-efficient. Its DMG system operates at a fraction of the processing power required by GPU-heavy models like ChatGPT, making it a sustainable alternative for large-scale content generation.
By combining AI precision, linguistic inclusivity and academic credibility, Botipedia positions itself as more than a digital library — it’s a step toward universal, unbiased access to verified knowledge.
"Botipedia is one of many initiatives of the Human and Machine Intelligence Institute (HUMII) that we are establishing at INSEAD", says Lily Fang, Dean of Research and Innovation at INSEAD. "It is a practical application that builds on INSEAD-linked IP to help people make better decisions with knowledge powered by technology. We want technologies that enhance the quality and meaning of our work and life, to retain human agency and value in the age of intelligence".
By harnessing AI to bridge gaps of language, geography and credibility, Botipedia points to a future where access to knowledge is no longer a privilege, but a shared global resource.
Keep Reading
AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.