A closer look at PMMI’s FastTrack initiative and why it matters for growing manufacturing firms
Updated
February 13, 2026 10:44 AM
Cardboard boxes in a warehouse. PHOTO: UNSPLASH
Large trade shows are built for scale. But for small and medium-sized manufacturers, that scale often creates distance between what’s on display and what they can actually use. Too many options, too little time, and very few tools designed for companies that are still growing. That mismatch is what PMMI is trying to correct with its new SMB FastTrack Program at PACK EXPO East 2026.
That is the problem PMMI is trying to address with its new SMB FastTrack Program, launching at PACK EXPO East 2026 in Philadelphia.
PMMI — the Association for Packaging and Processing Technologies — is the industry body behind the PACK EXPO trade shows and a central organization in the global packaging and processing sector. Through FastTrack, it has created a program (not an app or a product) designed to help small and mid-sized companies navigate the show more efficiently and connect with solutions that fit their scale.
The idea behind SMB FastTrack is simple: reduce friction. Instead of asking smaller firms to sort through hundreds of exhibitors and sessions on their own, the program curates what is most relevant to them. Exhibitors that offer flexible pricing, right-sized machinery, or SMB-focused services are clearly identified with visual icons in both the online directory and on the show floor. That way, a small manufacturer can quickly distinguish between enterprise-only vendors and partners that are realistically accessible.
The same logic carries into education. Rather than treating all attendees the same, PACK EXPO East 2026 will include a learning track specifically built around SMB realities. These sessions focus on issues that smaller teams actually face—how to hire and train workers, use AI without over-investing, improve food safety, cut operating costs, and adopt technology in stages. The goal is not inspiration, but applicability: content that reflects real constraints, not ideal scenarios.
Planning, too, is built into the structure of the program. Through a dedicated FastTrack landing page, participants can access curated supplier lists, recommended sessions, and planning tools that help organize their time before they ever step onto the show floor. Tools like category search and sustainability finders are meant to narrow choices quickly, turning a massive event into something manageable.
Seen together, these elements point to a broader intention. PMMI is not simply adding features—it is reshaping how smaller manufacturers experience a major industry event. Instead of competing for attention in a space built for scale, SMBs are given clearer paths to the people, tools, and knowledge that match where they actually are in their growth cycle.
What makes SMB FastTrack notable is not the technology behind it, but the intention behind it. PMMI is recognizing that progress for small and mid-sized manufacturers depends less on spectacle and more on fit—solutions that are accessible, affordable, and adaptable. The program is designed to help companies move with purpose, not pressure.
In an industry where visibility often follows size, SMB FastTrack represents a structural shift. It treats small and medium-sized manufacturers not as a subset of the audience, but as a distinct group with distinct needs. By doing so, PMMI is quietly redefining what a trade show can be: not just a marketplace of innovation, but a usable platform for companies still building their next stage of growth.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.