Deep Tech

How Is Technology Solving the Affordable Housing Crisis?

Can innovation truly deliver affordable housing to those who need it most?

Updated

January 8, 2026 6:35 PM

Close up of a 3D printer nozzle pouring concrete. PHOTO: ICON

The affordable housing crisis has become one of the most pressing challenges of our time. Across the globe, millions of people are struggling to secure a roof over their heads. In cities like San Francisco, housing prices are so high that even middle-income families find themselves shut out of the market.

The root of this crisis lies in a persistent imbalance: the supply of housing has failed to keep pace with growing demand. Factors such as high construction costs, bureaucratic hurdles, and limited available land in urban areas have made it increasingly difficult to build enough homes quickly and affordably. The result is a market where housing remains inaccessible to millions, even as the need becomes more urgent.

Technology is now stepping in to address these challenges in ways that were unimaginable just a decade ago. From streamlining construction processes to introducing new financing models and data-driven tools, tech innovations are rethinking how homes are built, financed, and accessed. But while these advancements offer hope, they also raise important questions: can they truly address the root causes of the housing crisis, or are they simply patching up a fractured system?

Building faster, smarter, and cheaper

The housing crisis begins with supply shortage: we simply aren’t building enough homes. Traditional construction methods are expensive, slow, and reliant on labor that is increasingly hard to find. This is where technology is making its most significant impact. Startups likeICON and Veev are leading the charge, using cutting-edge solutions to make housing more efficient and affordable.

ICON, for instance, uses 3D printing to build homes faster and at a lower cost. By printing the structure of a house directly on-site, ICON reduces waste, labor requirements, and construction time. Entire neighborhoods of 3D-printed homes are already being built, showcasing how this technology can scale.

Veev, on the other hand, focuses on prefabricated construction. By manufacturing high-quality components like walls and steel frames in a controlled factory environment, Veev eliminates inefficiencies associated with on-site building. These components are then assembled on location, drastically reducing construction time and costs. This approach mirrors the principles of mass production seen in industries like automotive manufacturing, where efficiency and scalability are key.

Breaking barriers to homeownership

While building more homes is essential, access to housing often depend son financing. For many people, especially those with low or irregular incomes, the traditional mortgage system presents insurmountable barriers. Fintech innovations are stepping in to make housing financing more inclusive and flexible.

Access to affordable housing often hinges on financing, and innovative financial technology (fintech) solutions are beginning to change the landscape. Some platforms are offering new ways for individuals to transition from renting to owning, while others are introducing shared equity models that reduce the traditional barriers of large down payments and strict credit requirements. For example, companies like Point use shared-equity financing, where homeowners receive funds in exchange for a percentage of their home’s future value instead of taking on traditional debt. Meanwhile, startups are building tools that automate and simplify and revolutionizing the mortgage process, making it easier for underserved populations to access loans tailored to their needs.

Blockchain technology is also changing the game. By digitizing land titles and creating secure records of financial transactions, blockchain reduces the complexity and difficulty of accessing credit, especially for those with limited traditional credit. This is particularly impactful in regions where informal economies dominate and traditional proof of income is scarce. These tools create a pathway to homeownership for individuals who would otherwise be excluded from the system.

Smarter data for smarter housing

Beyond building and financing, technology is transforming how we understand and address housing needs. Artificial intelligence (AI) is revolutionizing risk assessment in the mortgage industry by analyzing a broader range of financial behaviors, such as rent and utility payments, to provide a more inclusive picture of creditworthiness.

At the same time, AI and big data are helping policymakers and developers make smarter decisions about where and how to build. By analyzing population trends, commuting patterns, and infrastructure needs, these tools ensure that new housing developments are built in the right places, reducing wasteful construction and improving urban planning.

For example, startups are using 3D scanning and machine learning to map informal settlements and identify buildings at risk of collapse. These insights not only improve safety but also guide investment toward areas where housing is most desperately needed.

A vision for the future

The housing crisis is one of the most complex challenges of our time, and technology alone cannot solve it. But it can provide powerful tools to address specific pain points, from streamlining construction to expanding access to financing. Startups like ICON, Veev, and Landis are proving that innovation can lower costs, improve efficiency, and make housing more inclusive.

However, the ultimate solution lies in a combination of technology, policy reform, and community engagement. Governments must work alongside tech innovators to create urban environments that prioritize affordability, sustainability, and accessibility.

The future of housing isn’t just about building more homes; it’s about building smarter, greener, and fairer cities where everyone has a place to call home. By integrating cutting-edge technologies with forward-thinking policies, we can move closer to a world where affordable housing is not an aspiration but a reality.

The question is no longer whether technology can solve the housing crisis—it’s how we will use it wisely to create lasting change.

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Artificial Intelligence

AMD’s US$10 Billion Taiwan Expansion Signals a New Race for AI Infrastructure Scale

AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.

Updated

May 26, 2026 5:28 PM

Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH

As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.

The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.

The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.

AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.

The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.

At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.

Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.

Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.

Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.

Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.

AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.