A step forward that could influence how smart contracts are designed and verified.
Updated
January 8, 2026 6:32 PM
ChainGPT's robot mascot. IMAGE: CHAINGPT
A new collaboration between ChainGPT, an AI company specialising in blockchain development tools and Secret Network, a privacy-focused blockchain platform, is redefining how developers can safely build smart contracts with artificial intelligence. Together, they’ve achieved a major industry first: an AI model trained exclusively to write and audit Solidity code is now running inside a Trusted Execution Environment (TEE). For the blockchain ecosystem, this marks a turning point in how AI, privacy and on-chain development can work together.
For years, smart-contract developers have faced a trade-off. AI assistants could speed up coding and security reviews, but only if developers uploaded their most sensitive source code to external servers. That meant exposing intellectual property, confidential logic and even potential vulnerabilities. In an industry where trust is everything, this risk held many teams back from using AI at all.
ChainGPT’s Solidity-LLM aims to solve that problem. It is a specialised large language model trained on over 650,000 curated Solidity contracts, giving it a deep understanding of how real smart contracts are structured, optimised and secured. And now, by running inside SecretVM, the Confidential Virtual Machine that powers Secret Network’s encrypted compute layer, the model can assist developers without ever revealing their code to outside parties.
“Confidential computing is no longer an abstract concept,” said Luke Bowman, COO of the Secret Network Foundation. “We've shown that you can run a complex AI model, purpose-built for Solidity, inside a fully encrypted environment and that every inference can be verified on-chain. This is a real milestone for both privacy and decentralised infrastructure”.
SecretVM makes this workflow possible by using hardware-backed encryption to protect all data while computations take place. Developers don’t interact with the underlying hardware or cryptography. Instead, they simply work inside a private, sealed environment where their code stays invisible to everyone except them—even node operators. For the first time, developers can generate, test and analyse smart contracts with AI while keeping every detail confidential.
This shift opens new possibilities for the broader blockchain community. Developers gain a private coding partner that can streamline contract logic or catch vulnerabilities without risking leaks. Auditors can rely on AI-assisted analysis while keeping sensitive audit material protected. Enterprises working in finance, healthcare or governance finally have a path to adopt AI-driven blockchain automation without raising compliance concerns. Even decentralised organisations can run smart-contract agents that make decisions privately, without exposing internal logic on a public chain.
The system also supports secure model training and fine-tuning on encrypted datasets. This enables collaborative AI development without forcing anyone to share raw data—a meaningful step toward decentralised and privacy-preserving AI at scale.
By combining specialised AI with confidential computing, ChainGPT and Secret Network are shifting the trust model of on-chain development. Instead of relying on centralised cloud AI services, developers now have a verifiable, encrypted environment where they keep full control of their code, their data and their workflow. It’s a practical solution to one of blockchain’s biggest challenges: using powerful AI tools without sacrificing privacy.
As the technology evolves, the roadmap includes confidential model fine-tuning, multi-agent AI systems and cross-chain use cases. But the core advancement is already clear: developers now have a way to use AI for smart contract development that is fast, private and verifiable—without compromising the security standards that decentralised systems rely on.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.