A closer look at how machine intelligence is helping doctors see cancer in an entirely new light.
Updated
January 8, 2026 6:33 PM
Serratia marcescens colonies on BTB agar medium. PHOTO: UNSPLASH
Artificial intelligence is beginning to change how scientists understand cancer at the cellular level. In a new collaboration, Bio-Techne Corporation, a global life sciences tools provider, and Nucleai, an AI company specializing in spatial biology for precision medicine, have unveiled data from the SECOMBIT clinical trial that could reshape how doctors predict cancer treatment outcomes. The results, presented at the Society for Immunotherapy of Cancer (SITC) 2025 Annual Meeting, highlight how AI-powered analysis of tumor environments can reveal which patients are more likely to benefit from specific therapies.
Led in collaboration with Professor Paolo Ascierto of the University of Napoli Federico II and Istituto Nazionale Tumori IRCCS Fondazione Pascale, the study explores how spatial biology — the science of mapping where and how cells interact within tissue — can uncover subtle immune behaviors linked to survival in melanoma patients.
Using Bio-Techne’s COMET platform and a 28-plex multiplex immunofluorescence panel, researchers analyzed 42 pre-treatment biopsies from patients with metastatic melanoma, an advanced stage of skin cancer. Nucleai’s multimodal AI platform integrated these imaging results with pathology and clinical data to trace patterns of immune cell interactions inside tumors.
The findings revealed that therapy sequencing significantly influences immune activity and patient outcomes. Patients who received targeted therapy followed by immunotherapy showed stronger immune activation, marked by higher levels of PD-L1+ CD8 T-cells and ICOS+ CD4 T-cells. Those who began with immunotherapy benefited most when PD-1+ CD8 T-cells engaged closely with PD-L1+ CD4 T-cells along the tumor’s invasive edge. Meanwhile, in patients alternating between targeted and immune treatments, beneficial antigen-presenting cell (APC) and T-cell interactions appeared near tumor margins, whereas macrophage activity in the outer tumor environment pointed to poorer prognosis.
“This study exemplifies how our innovative spatial imaging and analysis workflow can be applied broadly to clinical research to ultimately transform clinical decision-making in immuno-oncology”, said Matt McManus, President of the Diagnostics and Spatial Biology Segment at Bio-Techne.
The collaboration between the two companies underscores how AI and high-plex imaging together can help decode complex biological systems. As Avi Veidman, CEO of Nucleai, explained, “Our multimodal spatial operating system enables integration of high-plex imaging, data and clinical information to identify predictive biomarkers in clinical settings. This collaboration shows how precision medicine products can become more accurate, explainable and differentiated when powered by high-plex spatial proteomics – not limited by low-plex or H&E data alone”.
Dr. Ascierto described the SECOMBIT trial as “a milestone in demonstrating the possible predictive power of spatial biomarkers in patients enrolled in a clinical study”.
The study’s broader message is clear: understanding where immune cells are and how they interact inside a tumor could become just as important as knowing what they are. As AI continues to map these microscopic landscapes, oncology may move closer to genuinely personalized treatment — one patient, and one immune network, at a time.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.