Can SPhotonix’s optical memory technology protect data better than today’s storage?
Updated
January 8, 2026 6:32 PM
SPhotonix's 5D Memory Crystals™. PHOTO: SPHOTONIX
SPhotonix, a young deep-tech startup, is working on something unexpected for the data storage world: tiny, glass-like crystals that can hold enormous amounts of information for extremely long periods of time. The company works where light and data meet, using photonics—the science of shaping and guiding light—to build optical components and explore a new form of memory called “5D optical storage”.
It’s based on research that began more than twenty years ago, when Professor Peter Kazansky showed that a small crystal could preserve data—from the human genome to the entire Wikipedia—essentially forever.
Their new US$4.5 million pre-seed round, led by Creator Fund and XTX Ventures, is meant to turn that science into real products. And the timing aligns with a growing problem: the world is generating far more digital data than current storage systems can handle. Most of it isn’t needed every day, but it can’t be thrown away either. This long-term, rarely accessed cold data is piling up faster than existing storage infrastructure can manage and maintaining giant warehouses of servers just to keep it all alive is becoming expensive and environmentally unsustainable.
This is the problem SPhotonix is stepping in to solve. They want to store huge amounts of information in a stable format that doesn’t degrade, doesn’t need electricity to preserve data and doesn’t require constant swapping of hardware. Instead of racks of spinning drives, the idea is a durable optical crystal storage system that could last for generations.
The company’s underlying technology—called FemtoEtch™—uses ultrafast lasers to engrave microscopic patterns inside fused silica. These precisely etched structures can function as high-performance optical components for fields like aerospace, microscopy and semiconductor manufacturing. But the same ultra-controlled process can also encode information in five dimensions within the crystal, transforming the material into a compact, long-lasting archive capable of holding massive amounts of information in a very small footprint.
The new funding allows SPhotonix to expand its engineering team, grow its R&D facility in Switzerland and prepare the technology for real-world deployment. Investors say the opportunity is significant: global data generation has more than doubled in recent years and traditional storage systems—drives, disks, tapes—weren’t designed for the scale or longevity modern data demands.
While the company has been gaining attention in research circles (and even made an appearance in the latest Mission Impossible film), its next step is all about practical adoption. If the technology reaches commercial viability, it could offer an alternative to the energy-hungry, short-lived storage hardware that underpins much of today’s digital infrastructure.
As digital information continues to multiply, preserving it safely and sustainably is becoming one of the biggest challenges in modern computing. SPhotonix’s work points toward a future where long-lasting, low-maintenance optical data storage becomes a practical alternative to today’s fragile systems. It offers a more resilient way to preserve knowledge for the decades ahead.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.