The CE approval opens Europe for Cornerstone Robotics as the company expands its global surgical robotics business
Updated
May 29, 2026 4:20 AM
A tray of surgical tools. PHOTO: UNSPLASH
As surgical robotics companies expand beyond domestic markets, regulatory approvals are becoming a critical part of global growth. Companies are no longer competing only on hardware and clinical performance. They are also competing on their ability to enter tightly regulated healthcare systems and build long-term hospital partnerships.
Hong Kong-based Cornerstone Robotics is now moving further into that phase of expansion after its Sentire Endoscopic Surgical System received CE Mark certification under the European Union’s Medical Device Regulation framework.
The approval allows the company to commercialize the system across European markets for minimally invasive procedures in general surgery, gynecology, thoracic surgery and urology. For surgical robotics companies, regulatory approvals often represent more than product validation. They also determine market access, hospital adoption opportunities and long-term commercial scale.
Cornerstone Robotics has already been building clinical operations in the UK ahead of the approval. Since 2025, the company has worked with Portsmouth Hospitals University NHS Trust on clinical investigations involving the Sentire Surgical System. According to the company, the system has been used across procedures involving urology, gynecology and gastrointestinal surgery. The company says the clinical investigation helped generate real-world data to support physician training, research and future adoption efforts.
Alongside the regulatory approval, Cornerstone Robotics is also expanding its local operations in Europe. The company established a UK subsidiary in 2025 and has been developing training, clinical support and after-sales service capabilities for hospitals using the system.
That operational buildout reflects a larger challenge inside surgical robotics. Hospitals adopting robotic systems often require ongoing clinical training, technical support and workflow integration alongside the hardware itself.
Cornerstone Robotics says its strategy centers around vertically integrated development across engineering, software, imaging and robotics systems. The company argues that this structure gives it greater control over product development, supply chain management and long-term operational stability.
Professor Samuel Au, Founder and CEO of Cornerstone Robotics, said: "Receiving CE Certification marks a major milestone in Cornerstone Robotics' evolution from a technology innovator to a global clinical solutions provider. From our first clinical investigation in Portsmouth, UK, to achieving European regulatory approval, each step of the journey reflects our commitment to proprietary innovation, product excellence, and clinical value. Looking ahead, we will continue expanding into key global markets and partnering with leading medical institutions to bring high-quality surgical robotic solutions to more physicians and patients worldwide."
The CE approval also comes several months after the company completed an oversubscribed financing round of approximately US$200 million in November 2025.
The funding and regulatory expansion together signal how surgical robotics companies are increasingly entering a more commercially focused stage of growth. Beyond research and development, companies are now investing more heavily in regulatory approvals, hospital partnerships, physician training and international operational infrastructure as competition expands across global healthcare markets.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.