From AI diagnostics to exoskeletons, the event highlights how healthcare tech is moving into real-world use
Updated
April 8, 2026 10:43 AM
Tesla Bot Optimus, designed by Tesla. PHOTO: ADOBE STOCK
The China International Medical Equipment Fair 2026 will open in Shanghai from April 9 to 12 at the National Exhibition and Convention Center. It is one of the largest gatherings in the medical device industry. This year’s edition will cover more than 320,000 square metres. Nearly 5,000 companies and brands are expected to participate, representing over 20 countries and regions. Organisers also expect more than 200,000 professional visitors and buyers from around 150 markets.
A key focus this year is the growing use of artificial intelligence in healthcare. One of the headline technologies is an AI agent designed to carry out multiple diagnoses from a single scan. The exhibition will also feature diagnostic software that is already in clinical use. In addition, an integrated platform for AI training and inference will be showcased to improve computing capacity within healthcare institutions.
Robotics will also play a central role at the event. New systems across surgical procedures, rehabilitation and elderly care are expected to be presented. Together, these developments point to a steady move toward more precise and assisted forms of care. Many of these technologies are designed to support clinicians and patients, especially in tasks that require consistent accuracy or long-term physical assistance.
For the first time, the event will introduce a dedicated Future Tech Arena. It will focus on brain-computer interfaces, embodied intelligence and university-led innovation. The space will include AI-assisted MRI systems for Alzheimer’s diagnosis. It will also feature brain-computer interface technologies used for cognitive assessment and training, along with wearable robotic exoskeletons.
Alongside product showcases, the event will continue to act as a platform for international trade and collaboration. An International Zone will host exhibitors from countries such as the United States, Germany, Japan, South Korea, the United Kingdom, France, Singapore, Malaysia and Thailand. This provides a view of how different markets are approaching medical technology. It also reflects the global nature of innovation and deployment in this sector.
The programme will include a set of networking and exchange formats under its “We” initiative. These include discussion stages with representatives from consulates and industry organisations, as well as matchmaking sessions based on verified buyer demand. Guided tours will also be organised to help international visitors connect with relevant exhibitors. In parallel, organisers are working with hospital partners to provide medical support services for attendees during the event.
Across the four days, hundreds of forums are scheduled. These will bring together policymakers, researchers and industry leaders to discuss regulatory frameworks, market access and the future of healthcare innovation. Some of these sessions will be led by the Global Harmonization Working Party in collaboration with the Ministry of Health of Malaysia, with a focus on regulatory alignment and cross-border cooperation in medical devices.
As healthcare systems continue to adopt digital tools and advanced equipment, events like CMEF provide a clear view of how these technologies are being developed and applied. The scale of participation this year reflects continued activity across both innovation and international collaboration in the medical device sector.
Keep Reading
The quiet infrastructure shift powering the next generation of data centers
Updated
February 12, 2026 1:21 PM
Peripheral Component Interconnect Express (PCIe) port on a motherboard, coloured yellow. PHOTO: UNSPLASH
Modern data centers operate on a simple yet fundamental principle: computers require the ability to share data extremely quickly. As AI and cloud systems grow, servers are no longer confined to a single rack. They are spread across many racks, sometimes across entire rooms. When that happens, moving data quickly and cleanly becomes harder.
Montage Technology, a Shanghai-based semiconductor company, builds the chips and connection systems that help servers exchange data without delays. This week, the company announced a new Active Electrical Cable (AEC) solution based on PCIe 6.x and CXL 3.x — two important standards used to connect CPUs, GPUs, network cards and storage inside modern data centers.
In simple terms, Montage’s new AEC product helps different parts of a data center “talk” to each other faster and more reliably, even when those parts are physically far apart.
As data centers grow to support AI and cloud workloads, their architecture is changing. Instead of everything sitting inside one rack, systems now stretch across multiple racks and even multiple rows. This creates a new problem: the longer the distance between machines, the harder it is to keep data signals clean and fast.
This is where Active Electrical Cables come in. Unlike regular copper cables, AECs include small electronic components inside the cable itself. These components strengthen and clean up the data signal as it travels, so information can move farther without getting distorted or delayed.
Montage’s solution uses its own retimer chip based on PCIe 6.x and CXL 3.x. A “retimer” refreshes the data signal so it arrives accurately at the other end. This allows servers, GPUs, storage devices and network cards to stay tightly connected even across longer distances inside large data centers.
The company also uses high-density cable designs and built-in monitoring tools so operators can track performance and fix issues faster. That makes large data centers easier to deploy and maintain.
According to Montage, the solution has already passed interoperability tests with CPUs, xPUs, PCIe switches and network cards. It has also been jointly developed with cable manufacturers in China and validated at the system level.
What makes this development important is not just speed. It is about scale. AI models, cloud services and real-time applications demand massive amounts of data to move continuously between machines. If that movement slows down, everything else slows with it.
By improving how machines connect across racks, Montage’s AEC solution supports the kind of infrastructure that next-generation AI and cloud systems depend on.
Looking ahead, the company plans to expand its high-speed interconnect products further, including work on PCIe 7.0 and Ethernet retimer technologies.
Quietly, in the background of every AI system and cloud service, there is a network of cables and chips doing the hard work of moving data. Montage’s latest launch focuses on making that hidden layer faster, cleaner and ready for the scale that modern computing now demands.