AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.
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As airports grow more complex, the real innovation lies in making their systems simpler, faster, and easier to act on
Updated
April 13, 2026 3:17 PM
An airplane parked at Josep Tarradellas Barcelona-El Prat Airport. PHOTO: UNSPLASH
Airports are some of the most complex systems in the world. Every day, they manage thousands of flights, passengers, crew schedules, gates and ground operations—all moving at the same time. But much of this still runs on older software that doesn’t connect well, making simple decisions harder than they need to be.
This is the gap companies like AirportLabs are trying to address. Instead of relying on multiple disconnected systems, their approach brings airport operations into one cloud-based platform. The goal is straightforward: take scattered data and turn it into something teams can actually use in real time.
In practice, this means combining core systems like flight databases, resource management and display systems into a single interface. When everything is connected, airport staff can respond faster—whether it’s adjusting gate assignments, managing delays, or coordinating ground crews. Rather than reacting late, decisions can be made as situations unfold.
Another shift is how this technology is built. Traditional airport systems often require heavy on-site infrastructure and long deployment timelines. In contrast, cloud-based platforms remove much of that complexity. Updates are faster, systems are easier to scale and teams spend less time maintaining servers and more time improving operations.
What stands out is the speed of adoption. Instead of multi-year rollouts, newer systems can be implemented in weeks, allowing airports to see improvements much sooner.
At a broader level, this reflects a familiar pattern seen across industries. As operations become more data-heavy, the advantage shifts to those who can simplify complexity. In aviation, that doesn’t just mean better technology—it means making the entire system easier to run.