AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.
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Backed by Menlo Ventures, BrainGrid tackles planning gaps as AI makes software building accessible to more founders.
Updated
April 20, 2026 1:40 PM
A phone screen with app icons. PHOTO: UNPSLASH
As artificial intelligence makes it easier to write code, a different problem is starting to surface. Building software is no longer limited by technical skill alone. Increasingly, the challenge lies in deciding what to build, how to structure it, and how to turn an idea into something that actually works.
That shift sits at the centre of BrainGrid, a startup that has raised $1 million in pre-seed funding led by Menlo Ventures, with participation from Next Tier Ventures and Brainstorm Ventures. The company is building what it describes as an AI-powered planning layer for people who want to create software but may not have a technical background.
The timing reflects a broader change in how products are being built. Tools like Claude Code and Cursor have made it possible to generate working code through simple prompts. For many first-time founders, this has lowered the barrier to entry. But writing code is only one part of the process. Turning that code into a reliable product requires structure, sequencing and clarity—areas where many projects begin to fall apart.
In traditional teams, this responsibility sits with product managers who define what needs to be built and in what order. Without that layer, even well-written code can lead to products that feel disjointed or incomplete. Features may not work together, integrations can break and the final product often does not match the original idea.
BrainGrid is designed to address that gap. Instead of focusing on generating code, it helps users map out the structure of a product before development begins. The aim is to give builders a clearer starting point so that the tools they use—whether human or AI—can produce more consistent results.
The company says more than 500 builders have already used it to create software products across areas like fitness, healthcare and productivity. These range from first-time founders experimenting with new ideas to experienced developers working independently. In many cases, the products are already live and generating revenue, suggesting that the demand is not just for experimentation but for building something that can scale.
For investors, the appeal lies in the evolving role of software development. As AI takes on more of the technical work, the value shifts toward defining the problem and structuring the solution. In that sense, planning becomes less of a background task and more of a core capability.
The US$1 million raise is relatively modest, but it points to a larger trend. As more people gain access to AI tools, the number of potential builders expands. What remains limited is the ability to organise ideas into products that work in the real world. If that shift continues, the next wave of software may not be defined by who can code, but by who can plan.