AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.
Keep Reading
From AI diagnostics to exoskeletons, the event highlights how healthcare tech is moving into real-world use
Updated
May 1, 2026 2:25 PM
Tesla Bot Optimus, designed by Tesla. PHOTO: ADOBE STOCK
The China International Medical Equipment Fair 2026 will open in Shanghai from April 9 to 12 at the National Exhibition and Convention Center. It is one of the largest gatherings in the medical device industry. This year’s edition will cover more than 320,000 square metres. Nearly 5,000 companies and brands are expected to participate, representing over 20 countries and regions. Organisers also expect more than 200,000 professional visitors and buyers from around 150 markets.
A key focus this year is the growing use of artificial intelligence in healthcare. One of the headline technologies is an AI agent designed to carry out multiple diagnoses from a single scan. The exhibition will also feature diagnostic software that is already in clinical use. In addition, an integrated platform for AI training and inference will be showcased to improve computing capacity within healthcare institutions.
Robotics will also play a central role at the event. New systems across surgical procedures, rehabilitation and elderly care are expected to be presented. Together, these developments point to a steady move toward more precise and assisted forms of care. Many of these technologies are designed to support clinicians and patients, especially in tasks that require consistent accuracy or long-term physical assistance.
For the first time, the event will introduce a dedicated Future Tech Arena. It will focus on brain-computer interfaces, embodied intelligence and university-led innovation. The space will include AI-assisted MRI systems for Alzheimer’s diagnosis. It will also feature brain-computer interface technologies used for cognitive assessment and training, along with wearable robotic exoskeletons.
Alongside product showcases, the event will continue to act as a platform for international trade and collaboration. An International Zone will host exhibitors from countries such as the United States, Germany, Japan, South Korea, the United Kingdom, France, Singapore, Malaysia and Thailand. This provides a view of how different markets are approaching medical technology. It also reflects the global nature of innovation and deployment in this sector.
The programme will include a set of networking and exchange formats under its “We” initiative. These include discussion stages with representatives from consulates and industry organisations, as well as matchmaking sessions based on verified buyer demand. Guided tours will also be organised to help international visitors connect with relevant exhibitors. In parallel, organisers are working with hospital partners to provide medical support services for attendees during the event.
Across the four days, hundreds of forums are scheduled. These will bring together policymakers, researchers and industry leaders to discuss regulatory frameworks, market access and the future of healthcare innovation. Some of these sessions will be led by the Global Harmonization Working Party in collaboration with the Ministry of Health of Malaysia, with a focus on regulatory alignment and cross-border cooperation in medical devices.
As healthcare systems continue to adopt digital tools and advanced equipment, events like CMEF provide a clear view of how these technologies are being developed and applied. The scale of participation this year reflects continued activity across both innovation and international collaboration in the medical device sector.