AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.
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A planned city explores how real-time data and automation can shape everyday urban systems
Updated
May 1, 2026 2:25 PM
A package being delivered by drone using the Meituan app. PHOTO: ADOBE STOCK
A newly built district in northern China is being used to test how cities function when infrastructure, data and automation are integrated from the ground up. In Xiong'an New Area, traffic systems, public monitoring and urban services are designed to respond in real time rather than operate on fixed rules.
At the centre of this is a traffic management system powered by more than 20,000 roadside sensors. These track traffic flow, vehicle types and congestion levels, feeding data into an AI system that adjusts signals in milliseconds. Official figures show this has reduced the average number of stops per vehicle by half. The system also detects equipment faults, sends alerts and generates maintenance requests without manual input.
Automation extends beyond roads. Drones are deployed across the city for routine monitoring. In the Rongdong district, roadside units release drones that follow fixed patrol routes of around 1.27 kilometres, completing each run in about five minutes. They are used to monitor traffic, detect illegal parking and inspect public spaces. Similar systems operate in parks to track water levels and issue flood alerts, while in some work zones, drones transport packages of up to five kilograms between buildings.
These applications reflect a broader approach: integrating multiple systems into a single, connected urban framework. Unlike older cities where infrastructure evolves in layers, Xiong’an has been built with coordinated digital systems from the outset. This allows transport, maintenance and public services to operate through shared data systems rather than in isolation.
Alongside this, the area is being developed as a technology and innovation hub. Since its establishment in 2017, it has attracted more than 400 branches of state-owned enterprises and over 200 companies working in sectors such as artificial intelligence, aerospace information and digital technology.
This ecosystem supports projects like the “Xiong’an-1” satellite, which completed research, design, production and testing within eight months of regulatory approval in 2025. The satellite is currently undergoing testing, with a planned launch expected in the second quarter of 2026. It forms part of a broader push to build an aerospace information industry in the region.
The area is also structured to bring companies, research and production closer together. At the Zhongguancun Science Park in Xiong’an, which spans 207,000 square metres, 269 technology companies operate across sectors including AI, robotics and biotechnology. The park hosts more than 2,700 researchers and industry professionals, with companies organised into sector-specific clusters.
Policy support continues to shape this development. In early 2026, the State Council approved the upgrade of Xiong’an’s high-tech industrial development zone to national level status, with a focus on attracting high-end research and strengthening links between scientific development and industrial output.
Xiong’an is positioned as a testing ground for how smart city systems can be deployed at scale. The model depends on coordinated planning, integrated infrastructure and sustained policy support. Whether these systems can be adapted to existing cities, where infrastructure and governance are more fragmented, remains an open question.