AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM
Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.
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Circles is using AI to turn telecom support from a cost centre into a faster, more personalised growth engine
Updated
May 19, 2026 5:44 PM
A woman holding a phone while using a laptop. PHOTO: ADOBE STOCK
Circles, a Singapore startup that builds software for digital telecom operators, has launched an AI concierge as part of its partnership with OpenAI. The release marks a new step in the company’s effort to modernise how telecom providers serve and retain customers. The move reflects a wider shift in the telecom sector. Many operators still rely on older support systems that can be slow, fragmented and costly to run. AI is now being tested as a way to improve service while creating new revenue opportunities.
Circles said the concierge is built on OpenAI’s API platform and sits within what it calls an AI-native telecom stack. In practical terms, the system is designed to handle customer support, account changes and personalised offers through automated interactions.
One part of the platform is called CareX. According to the company, it can deal with billing issues, service requests and network-related problems. Circles said CareX currently resolves 85% of customer queries globally without human intervention and reaches a 95% resolution rate on end-to-end tasks. That matters because customer support remains one of the larger operating costs for telecom providers. Faster automated handling could lower pressure on service teams while reducing wait times for users.
The second part of the platform is Xplore IQ, which focuses on revenue growth. The tool is designed to predict what a customer may need, recommend a suitable plan or offer and complete upgrades or downgrades automatically. Circles said the early rollout has led to a 22% rise in average revenue per user for Circles.Life Singapore. It also said personalised offers helped reduce customer churn by 9%.
"AI should empower users - not force-fit into outdated journeys. OpenAI's role has been critical in enabling Circles to scale this vision globally. With the AI concierge, we are moving beyond providing simple answers to delivering real-world outcomes, along with balancing cost and latency to maximize value for operators and customers alike", said Awais Malik, Global Chief Growth Officer at Circles.
"Circles is demonstrating how advanced AI can modernize essential industries like telecommunications at scale. By combining frontier models with multi-agent systems, they are enabling telecom operators globally to deliver faster, smarter and more personalized customer experiences. This milestone is a strong example of how AI can deliver tangible value for businesses and customers they serve", Oliver Jay, Managing Director, International for OpenAI, added.
Together, the tools are intended to connect customer service, operations and sales into one system. Rather than treating support and monetisation as separate functions, the company is combining them into a single digital layer.
Circles said the partnership will continue over the next two years as both companies work toward a more autonomous telecom model. Whether that vision is achieved remains to be seen, but the direction is clear: telecom operators are increasingly treating AI as core infrastructure rather than an optional add-on.