A new safety layer aims to help robots sense people in real time without slowing production
Updated
March 17, 2026 1:02 AM

An industrial robot in a factory. PHOTO: UNSPLASH
Algorized has raised US$13 million in a Series A round to advance its AI-powered safety and sensing technology for factories and warehouses. The California- and Switzerland-based robotics startup says the funding will help expand a system designed to transform how robots interact with people. The round was led by Run Ventures, with participation from the Amazon Industrial Innovation Fund and Acrobator Ventures, alongside continued backing from existing investors.
At its core, Algorized is building what it calls an intelligence layer for “physical AI” — industrial robots and autonomous machines that function in real-world settings such as factories and warehouses. While generative AI has transformed software and digital workflows, bringing AI into physical environments presents a different challenge. In these settings, machines must not only complete tasks efficiently but also move safely around human workers.
This is where a clear gap exists. Today, most industrial robots rely on camera-based monitoring systems or predefined safety zones. For instance, when a worker steps into a marked area near a robotic arm, the system is programmed to slow down or stop the machine completely. This approach reduces the risk of accidents. However, it also means production lines can pause frequently, even when there is no immediate danger. In high-speed manufacturing environments, those repeated slowdowns can add up to significant productivity losses.
Algorized’s technology is designed to reduce that trade-off between safety and efficiency. Instead of relying solely on cameras, the company utilizes wireless signals — including Ultra-Wideband (UWB), mmWave, and Wi-Fi — to detect movement and human presence. By analysing small changes in these radio signals, the system can detect motion and breathing patterns in a space. This helps machines determine where people are and how they are moving, even in conditions where cameras may struggle, such as poor lighting, dust or visual obstruction.
Importantly, this data is processed locally at the facility itself — not sent to a remote cloud server for analysis. In practical terms, this means decisions are made on-site, within milliseconds. Reducing this delay, or latency, allows robots to adjust their movements immediately instead of defaulting to a full stop. The aim is to create machines that can respond smoothly and continuously, rather than reacting in a binary stop-or-go manner.
With the new funding, Algorized plans to scale commercial deployments of its platform, known as the Predictive Safety Engine. The company will also invest in refining its intent-recognition models, which are designed to anticipate how humans are likely to move within a workspace. In parallel, it intends to expand its engineering and support teams across Europe and the United States. These efforts build on earlier public demonstrations and ongoing collaborations with manufacturing partners, particularly in the automotive and industrial sectors.
For investors, the appeal goes beyond safety compliance. As factories become more automated, even small improvements in uptime and workflow continuity can translate into meaningful financial gains. Because Algorized’s system works with existing wireless infrastructure, manufacturers may be able to upgrade machine awareness without overhauling their entire hardware setup.
More broadly, the company is addressing a structural limitation in industrial automation. Robotics has advanced rapidly in precision and power, yet human-robot collaboration is still governed by rigid safety systems that prioritise stopping over adapting. By combining wireless sensing with edge-based AI models, Algorized is attempting to give machines a more continuous awareness of their surroundings from the start.
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AI growth is increasingly becoming a manufacturing, packaging and deployment challenge — not just a computing one.
Updated
May 26, 2026 5:28 PM

Taipei 101 and Taipei Nan Shan Plaza, viewed from Elephant Mountain. PHOTO: UNSPLASH
As AI companies continue scaling larger models and data centers, the pressure is no longer falling only on chip design. Manufacturing capacity, advanced packaging and infrastructure deployment are becoming equally important parts of the AI race. AMD’s latest investment announcement reflects how quickly that shift is accelerating.
The US chipmaker announced plans to invest more than US$10 billion across Taiwan’s semiconductor and manufacturing ecosystem to support next-generation AI infrastructure. The investment focuses on expanding partnerships and increasing advanced packaging capacity needed for future AI systems.
The announcement highlights a growing reality across the AI industry. Building powerful AI chips is no longer enough on its own. Companies now also need the manufacturing networks, packaging technologies and supply chain coordination required to deploy AI infrastructure at global scale.
AMD’s investments center heavily around advanced chip packaging, an area becoming increasingly critical as AI systems demand higher performance and greater power efficiency. Traditional chip architectures are struggling to keep pace with the size and complexity of modern AI workloads. Advanced packaging helps connect processors, memory and computing systems more efficiently while managing power and cooling limitations inside large-scale AI environments.
The company said it is working with Taiwan-based partners including ASE, SPIL and PTI to develop next-generation packaging technologies for its upcoming 6th Gen AMD EPYC processors, codenamed “Venice.” AMD also said it had qualified what it described as the industry’s first 2.5D panel-based EFB interconnect technology alongside PTI.
At the center of the broader strategy is AMD Helios, the company’s rack-scale AI infrastructure platform scheduled for deployment beginning in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking systems and AMD’s ROCm software stack into integrated AI infrastructure systems designed for hyperscale deployment.
Rather than selling individual processors alone, companies are increasingly building complete AI infrastructure platforms that combine hardware, software, cooling systems and power management into unified deployments. That transition is reshaping how AI infrastructure is designed, manufactured and delivered.
Taiwan is also becoming more deeply embedded in that process. AMD’s investment spans not only semiconductor packaging companies but also manufacturing and system integration partners including Sanmina, Wiwynn, Wistron and Inventec. The partnerships reflect Taiwan’s growing role as one of the operational centers of the global AI infrastructure economy.
Dr. Lisa Su, Chair and CEO of AMD, said: “As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems”.
Power efficiency is becoming another major challenge shaping AI infrastructure decisions. As AI workloads consume more electricity and generate more heat, infrastructure providers are increasingly being forced to rethink cooling systems, interconnect technologies and deployment economics.
AMD’s announcement signals how the AI competition is evolving beyond model development and raw computing power. The next stage may depend just as heavily on who can manufacture, package and deploy AI infrastructure fast enough to support global demand.