Artificial Intelligence

Why AI’s Biggest Infrastructure Problem May No Longer Be Computing Power

Huawei is betting that the future of AI infrastructure will depend as much on energy systems as on computing power

Updated

May 19, 2026 5:43 PM

Blue light painting with a lightbulb. PHOTO: UNSPLASH

As AI companies build larger models and deploy more AI agents, the industry is running into a new constraint: electricity. The challenge is no longer just about computing power. It is increasingly about how to supply, manage and sustain the energy needed to run AI infrastructure at scale.

That was the central argument behind Huawei’s latest AI data center strategy unveiled at its Global AIDC Industry Summit in Dongguan.

The company introduced what it calls a grid-interactive AIDC strategy, focused on redesigning AI data centers around power supply, cooling systems and energy management. AIDC refers to AI data centers built specifically for large-scale AI computing workloads.

The announcement reflects a broader shift happening across the industry. As AI systems grow larger, data centers are consuming more electricity and generating more heat than traditional computing infrastructure was designed to handle. Companies are now being forced to rethink not just chips and servers, but the physical systems supporting them.

Huawei argues that future AI infrastructure will need closer coordination between computing systems and energy grids. The company says traditional data center designs are struggling to keep up with fluctuating AI workloads, rising power density and the growing use of renewable energy sources.

Hou Jinlong, Director of the Board of Huawei and President of Huawei Digital Power, said: "The booming AI industry, widely adopted large models, and numerous AI agents are creating huge energy demands, set to boost the global AIDC capacity. Electricity is essential for computing; energy is the foundation for AI long-term development. Computing and electricity will deeply synergize and empower each other, progressively building an integrated framework that brings together new power systems and AI infrastructure."

A large part of Huawei’s strategy focuses on power architecture. AI workloads can create sudden spikes in electricity demand, especially in high-density computing environments. To manage that, Huawei says it plans to develop new power systems that combine grid-friendly UPS infrastructure with energy storage technologies.

Cooling is becoming another major pressure point. AI servers generate significantly more heat than traditional enterprise systems and Huawei says liquid cooling is now becoming essential for large-scale AI deployments. The company introduced a liquid cooling system designed to improve long-term thermal management inside high-density AI environments.

Huawei is also pushing modular construction methods to reduce deployment times for AI data centers. Instead of building infrastructure entirely onsite, parts of the system can be prefabricated and tested in factories before installation.

Bob He, Vice President of Huawei Digital Power, said: "The global AI industry is booming, and the token demand surges. As such, the AIDC industry is entering the Token era."

As part of that shift, Huawei introduced a proposed measurement system called the TokEnergy Index. The company says the metric is designed to measure the relationship between energy consumption and AI computing output, rather than relying only on traditional data center efficiency metrics such as PUE.

The broader message behind the strategy is that AI infrastructure is becoming an energy engineering problem as much as a computing problem. As global demand for AI continues to rise, companies across the sector are beginning to realise that the future of AI may depend not only on better models, but also on whether power grids and data centers can keep up with them.

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Deep Tech

Why STMicroelectronics Is Deploying Humanoid Robots Inside Chip Factories

The collaboration between Oversonic Robotics and STMicroelectronics highlights how robotics is beginning to fill gaps traditional automation cannot.

Updated

January 23, 2026 10:41 AM

3D render of humanoid robots working in a factory assembly line. PHOTO: ADOBE STOCK

Oversonic Robotics, an Italian company known for building cognitive humanoid robots, has signed an agreement with STMicroelectronics, one of the world’s largest semiconductor manufacturers, to deploy humanoid robots inside semiconductor plants.  

According to the companies, this is the first time cognitive humanoid robots will be used operationally inside semiconductor manufacturing facilities. And the first deployment has already taken place at ST’s advanced packaging and test plant in Malta.

At the center of the collaboration is RoBee, Oversonic’s humanoid robot. RoBee is designed to carry out support tasks within industrial environments, particularly where flexibility and interaction with human workers are required. In ST’s factories, the robots will assist with complex manufacturing and logistics flows linked to new semiconductor products. They are intended to work alongside existing automation systems, not replace them.  

RoBee is notable for its ability to operate in environments shared with people. It is currently the only humanoid robot certified for use in both industrial and healthcare settings and is already in operation within several Italian companies. The robot is also being used in experimental hospital programs. That background helped position RoBee for deployment in tightly controlled manufacturing environments such as semiconductor plants.

Fabio Puglia, President of Oversonic Robotics, described the agreement as a milestone for deploying humanoid robots in complex industrial settings: “The partnership with STMicroelectronics is a great source of pride for us because it embodies the vision of cognitive robotics that Oversonic has brought to the industrial and healthcare markets. Being the first to introduce cognitive humanoid robots in a sophisticated production context such as semiconductors means measuring ourselves against the highest standards in terms of reliability, safety and operational continuity. This agreement represents a fundamental milestone for Oversonic and, more generally, for the industrial challenges these new machines are called to face in innovative and highly complex environments, alongside people and supporting their quality of work”.

From STMicroelectronics’ side, the use of humanoid robots is framed as part of a broader effort to manage growing manufacturing complexity. he company said RoBee will support complex tasks and help manage the intricate production flows required by newer semiconductor products. It is also expected to contribute to improved product quality and shorter manufacturing cycle times. The robots are designed to integrate with existing automation and software systems, helping improve safety and operational continuity.  

In semiconductor manufacturing, precision and reliability leave little room for experimentation. Therefore, introducing humanoid robots into this environment signals a practical shift. It shows how robotics is starting to fill gaps that traditional automation has struggled to address.